Low-Temperature Ultra-Fine Epoxy Solder Paste

The melting point of the low-temperature epoxy solder paste alloy is below 180℃. The low-temperature epoxy solder paste is made of bismuth-based alloy. The existence of bismuth-rich layers easily causes a brittle fracture, poor dropping performance, and poor solderability.

Medium and High Temperature Ultra-Fine Epoxy Solder Paste

Medium and high temperature solder adhesive (epoxy solder paste) is a solder using SnAgCu alloy and SnSb alloy as metal filler particles.

Anisotropic Conductive Paste

Low-temperature metallurgical-connection halogen-free anisotropic conductive paste is used to manufacture touch screens, smart cards, radio frequency identifications (RFID), flip chips, flexible printed circuits (FPC), and other products.

Gold-Tin Solder Paste

Gold-tin solder paste is one of the most reliable solder materials for microelectronics and semi-conductor, which can be used in military, aerospace, and medical equipment with reliable packaging.

High-Temperature Solder Paste for Multiple Reflow Soldering

High-temperature lead-free solder paste is a lead-free solder paste with a minimum alloy melting point of 260°C, which is suitable for multiple reflow soldering of power semiconductor packaging and microelectronic packaging.