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Medium and High Temperature Ultra-Fine Epoxy Solder Paste

Medium and high temperature solder adhesive (epoxy solder paste) is a solder using SnAgCu alloy and SnSb alloy as metal filler particles. Compared with medium and high temperature solder paste, epoxy resin or silicone resin is used to replace rosin resin. The application of solder adhesive is the same as solder paste. After reflow, the alloy powder and soldering pad are metallurgically connected. Resin component cures and becomes thermoset adhesive around solder joints, which makes it unnecessary to clean. The thermoset adhesive reinforces and boosts the electrical performance of solder joints. Solder adhesive is a new type of electronic packaging material.

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Products Description

Product Documentation

FSA-305D

FSA-305P

FSA-901P-D

Description

Properties

Instructions

FSA-305D series medium-temperature fine-pitch ultra-fine solder paste (SnAgCu epoxy solder paste) is composed of SAC305 solder powder and halogen-free flux. Only a tiny amount of solvent evaporates during the soldering and curing process. There is no solder ball formation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which are equivalent to the soldering effect of solder paste. Compared with rosin solder paste, the solder residue becomes thermosetting adhesive to enhance the solder joint strength, corrosion resistance, and insulation. FSA-305 is a type of no-clean solder paste. It is a superior solder for medium temperature soldering.


FSA-305D

FSA-305D

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Stencil Cleaning Solvent: Ether. Propylene glycol monomethyl ether (PM) is preferred.

Product Display

Properties

Instructions

FSA-305P

FSA-305P

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Stencil Cleaning Solvent: Ether. Propylene glycol monomethyl ether (PM) is preferred.

Description

Properties

Instructions

FSA-901 series epoxy solder paste is composed of high-temperature Sn90Sb10 solder powder and halogen-free flux. Only a tiny amount of solvent evaporates during the soldering and curing process. There is no solder ball formation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which are equivalent to the soldering effect of solder paste. FSA-901 epoxy solder paste is unnecessary to clean. The solder residue becomes thermosetting adhesive to reinforce the solder joints and enhance the anti-corrosion and insulation performance. The product is excellent for high-temperature soldering.


FSA-901P-D

FSA-901P-D


Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Stencil Cleaning Solvent: Ether. Propylene glycol monomethyl ether (PM) is preferred.

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