Search
Gold tin solder paste, Ultra-fine solder past...
10 +
T2-T10 All-Size Cases
20 +years
Industry Experience
20 +
Research Staff
40 +
Patents
WHO WE ARE
Fitech's Ultra-Fine Solder for Customer Innovation
Shenzhen Fitech Co., Ltd. is a global leader in providing soldering solutions for microelectronics and semiconductor packaging, with over 20 years of dedicated experience in the industry.
The company offers a comprehensive product line, ranging fromsolder alloy powderto ultra-fine soldering application products. It is currently the only manufacturer in the world capable of producing microelectronics and semiconductor packaging materials in the full range ofultra-fine solder alloys, from T2 to T10.
Fitech’s ultra-fine solder pastes, fluxes, and full size and variety of solder alloy powder are widely applied across various sectors of microelectronics and semiconductor packaging. These products have gained widespread recognition from global SMT electronic chemical manufacturers, micro-optoelectronic manufacturers, and semiconductor packaging and testing companies. The company has established stable and long-term business partnerships with clients in over 20 countries........
Solder paste, as an important electronic soldering material, plays a vital role in the electronics manufacturing industry. Its main function is to provide high quality solder connections, reduce oxidation, provide wettability and conductive heat transfer. Fitech solder paste covers a wide range of models and specifications, including ultra-fine solder paste, Gold-tin solder paste, medium temperature solder paste SAC305, low temperature solder paste, high temperature solder paste, etc., which are suitable for different microelectronics and semiconductor packaging needs.
View More
Solder powder is a kind of connecting material used in electronic industry, which is mainly composed of Sn (tin) and other metals (such as Pb, Ag, Cu, etc.) as alloy powder. Fitech solder powder adopts Fitech's patented powder making technology - liquid phase molding spherical alloy powder technology, which applies the principle of ultrasonic cavitation effect, and can be used for the preparation of ultra-fine solder powder T6 (5~15μm)， T7(2~11μm)，T8 (2~8μm)，T9 (1~5μm)，T10 (1~3μm)，and has already been mass-produced on a large scale. This technology enables the solder powder to have excellent sphericity and low oxygen content, which ensur
View More
Flux is an important and indispensable material in the soldering process, with the main functions of removing oxides, preventing re-oxidation, reducing surface tension and increasing the soldering area.Fitech fine pitch flux is a flux material used in microelectronics and semiconductor production, assembly and packaging. It is suitable for high-precision and high-reliability packaging in the fields of wafer bump soldering, chip vaporization soldering, BGA, SiP, CSP, MicroLED packaging.
View More
Our Professional Team is Here to Help
Our team is filled with seasoned experts who can’t wait to help you find the right solution for your business.
Contact Us NowDue to its high-quality and high-tech production and development, Fitech's products are used in various applications, including microelectronic packages and power device packages, such as simple 3C products, electronic packages in automobiles, IoT and wearable devices, medical devices, military and aerospace, LED packages, rail transportation and 5G...
FITECH's partners are all over the world, involving microelectronics, semiconductors, automotive, medical, military and other industries; We have a mature product line and can also assist our customers to make specific welding solutions for their specific projects. We work with customers to make progress and develop together....
Learn More
The Parameters Affecting Centrifugal Atomized Solder Powder
Semiconductor packaging processes such as SMT, BGA, solid crystal, etc. often use solder paste. Solder paste is composed of solder powder and flux. The highest proportion is solder powder.
View More05
Jun, 2026
Mechanism of P segregation at the weld interface of ENIG Ni(P) coatings
P segregation is a phenomenon that occurs when metallurgical reactions between Ni and Sn in the solder lead to an enrichment of P in the Ni(P) layer near the weld interface when reflow soldering with ENIG Ni(P) layers.
View More02
Jun, 2026
Is Cleaning Necessary When Using No-Clean Flux?
Flux is an indispensable substance in the soldering process, its role is to remove the oxides of the soldered parts, increase the wettability of the soldered joints, and improve the quality and reliability of soldering.
View More29
May, 2026
Introduction to FCCSP Flip Chip Packaging Process
As mobile, networking and consumer electronic devices are updated, electronics are becoming more and more functional and smaller in size, with ever-increasing performance requirements for semiconductor packages.
View More26
May, 2026
How to Avoid the Problem of Dropping Parts of the Second Reflow When Double-Sided Mounting?
Double-sided mounting process can improve the actual utilisation of PCB, reduce manufacturing costs, and meet the demand for miniaturisation and high integration of end products. However, the use of double-sided mounting, double-sided reflow process will bring the following problems.
View More22
May, 2026
Surface mount technology is one of the most important technologies in the electronics industry, where components are attached to a printed circuit board by means of solder paste.
View More19
May, 2026
Alexander
I have been using this, the solder paste does not dry out in winter, the quality is particularly stable Recommended purchase.The seller's service is also very good, customs clearance is fast, and the speed of delivery is unbeatable. The price is also real, worthy of cooperation and trust!
David
Real manufacturers direct sales, product quality is no excuse, with SGS and other well-known institutions of the test report, the user can rest assured that the use of both environmental protection and safety.
Andrew
It is understood that Fitech solder paste in its domestic has a great influence, in 2014 on the independent research and development and production of T2-T10 particle size of the solder paste, only recently began to layout overseas, in fact, it is also more than 20 years of brand old shop.
Honey
With the use of Fuyinda's solder paste, fast tin down, strong oxidation resistance, good wettability, in particular, it can also be customised for the user's different scenarios of different alloys of solder powder, the configuration of different solder paste. This is for the modern electronics industry, the trend of ultra-micro is becoming more and more obvious, more and more popular with users.
