Low-Temperature Ultra-Fine Epoxy Solder Paste

The main alloy component of  FSA-170D series epoxy solder paste is Fitech’s FL170 low-temperature alloy solder powder (SnBiAgX).  Fitech classifies FL170 solder powders into T4 to T7 based on particle sizes. The solder powder and epoxy-based flux are formulated into superior low-temperature high-reliability solder paste.

1. Excellent sphericity, uniform particle size, low oxygen content, and high strength;

2. Reduce solvent volatilization during the curing process;

3. Halogen-free, no clean；
4. Reduce solder ball formation after soldering;

5. The solder joints are metallurgically connected, which are equivalent to the soldering effects of solder paste;

6. The soldering residue becomes thermosetting adhesive, which is attached around the solder joint to improve its strength and enhance the anti-corrosion and insulation performance;

7. It is suitable for reliable packaging of thin substrates and non-heat-resistant components.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Stencil Cleaning Solvent: Ether. Propylene glycol monomethyl ether (PM) is preferred.

FSA-170P (180P/200P) series low-temperature lead-free high reliability solder adhesive (epoxy solder paste) products are composed of low-temperature alloy solder powder and halogen-free flux. Only a tiny amount of solvent evaporates during the soldering and curing process. There is no solder ball generation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which are equivalent to the soldering effect of solder paste. FSA-170P epoxy solder paste is unnecessary to clean. The solder residue becomes thermosetting adhesive to reinforce the solder joint and enhance the anti-corrosion and insulation performance. The product is suitable for the reliable packaging of thin substrates and non-heat-resistance components.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Cleaning Instruction: There is a small amount of residue around the pad after reflow, which should be cleaned with deionized water as soon as possible. The temperature of deionized water is between 25°C and 40°C.

FSA-574D series low-temperature lead-free epoxy solder paste is composed of low-temperature ultra-fine SnBi solder powder and halogen-free flux. Only a tiny amount of solvent evaporates during the soldering and solidification process. There is no solder ball formation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which are equivalent to the soldering effects of solder paste. FSA-574D epoxy solder paste is unnecessary to clean. Solder residue becomes thermosetting adhesive to reinforce the solder joints and enhance the anti-corrosion and insulation performance. FSA-574D is suitable for the reliable packaging of thin substrates and non-heat-resistant components.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Stencil Cleaning Solvent: Ether. Propylene glycol monomethyl ether (PM) is preferred.

FSA-574P series low-temperature lead-free epoxy solder paste products are made of low-temperature ultra-fine SnBi solder powder and halogen-free flux. Only a tiny amount of solvent evaporates during the soldering and curing process. There is no solder ball generation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which are equivalent to the soldering effect of solder paste. FSA-574P epoxy solder paste is unnecessary to clean. The solder residue becomes thermoset adhesive to reinforce the solder joints and enhance the anti-corrosion and insulation performance. FSA-574P is suitable for the reliable packaging of thin substrates and non-heat-resistance components components.

Recovery method:Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste

Operation Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Stencil Cleaning Solvent: Ether. Propylene glycol monomethyl ether (PM) is preferred.