Products Description
Product Documentation
High-temperature lead-free solder paste is a lead-free solder paste with a minimum alloy melting point of 260°C, which is suitable for multiple reflow soldering of power semiconductor packaging and microelectronic packaging. Fitech adopts FH260 solder powder with excellent sphericity, uniform particle size and low oxygen content, and excellent halogen-free flux to produce secondary reflow solder paste, which meets the RoHS environmental protection standards. FH-260 product covers a wide range of particle sizes from T4 to T6, making it applicable to printing (FH-260P series) and dispensing (FH-260D series) process.FH-260 is synthesized based on bismuth elements by adding reinforced micro/nanoparticles, which successfully replaces high-lead solder paste and meets RoHS environmental protection standards. Different solder powder particle sizes and metal contents can be
provided to satisfy various customers’ requirements for products and
processes.
FH-260D
FH-260P
Description
Properties
Instructions
FH-260 solder powder with excellent sphericity, uniform particle size, and low oxygen content is combined with halogen-free flux to produce FH-260D series solder paste. It is a high-temperature lead-free product developed for secondary reflow soldering of power semiconductor and microelectronic packaging. FH-260 is synthesized based on bismuth elements by adding reinforced micro/nanoparticles, which successfully replaces high-lead solder paste and meets RoHS environmental protection standards.
Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.
Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.
Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.
Description
Properties
Instructions
FH260 solder powder with excellent sphericity, uniform particle size, and low oxygen content is combined with halogen-free flux to produce FH-260P series solder paste. It is a high-temperature lead-free product developed for secondary reflow of power semiconductor and microelectronic packaging. FH-260 is synthesized based on bismuth elements by adding reinforced micro/nanoparticles, which successfully replaces high-lead solder paste and meets RoHS environmental protection standards.
Temperature(200°C) Water-Soluble
Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.
Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.
Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste
Operation Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.
Product Manual
Related Products
Related Applicaiton
Our Professional Team is Here to Help
Our team is filled with seasoned experts who can’t wait to help you find the right solution for your business.
Contact Us Now
