Anisotropic Conductive Paste

FACA-138D series is a low-temperature metallurgical-bonding halogen-free anisotropic conductive paste (ACP). The main alloy component of FACA-138D is SnBiAg0.4. The low-temperature conductive paste is produced by combining epoxy-based flux with the ultra-narrow particle size and ultra-fine solder powders which are classified into T8 powder (2-8um), T9 powder (1-5um), and T10 powder (1-3um) based on particle sizes

1. The conductive filler has uniform particle size, and FACA-138D has outstanding dispersion performance;

2. After hot-pressing solidification, the bonding of insulated materials increases soldering reliability;

3. There is no solvent volatilization during the hot-pressing curing process;
4. The hot-pressing temperature is low, metallurgical connection with the pad, high bonding strength after hot pressing curing;

5. FACA-138D is an extraordinary anisotropic conductive solder that is longitudinal conductive and non-conductive in the transverse direction.

1. Storage: It should be stored in the refrigerator as soon as possible after receipt. The recommended storage temperature is -20±5°C. If the temperature is too high, it will shorten its service life and affect its characteristics.

2. Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

3. Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

4. Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.When taking out solder paste from the cold box, its temperature is much lower than the room temperature. If the bottle cap opens without rewarming, the water vapor in the air will easily condense and adhere to the solder paste. The high temperature exceeding 150℃ during soldering increases the vaporization rate of water, which may cause the phenomenon of "exploding solder" to produce solder balls and even damage the components.

5. Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively.