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Solder Paste

Solder paste, as an important electronic soldering material, plays a vital role in the electronics manufacturing industry. Its main function is to provide high quality solder connections, reduce oxidation, provide wettability and conductive heat transfer. Fitech solder paste covers a wide range of models and specifications, including ultra-fine solder paste, Gold-tin solder paste, medium temperature solder paste SAC305, low temperature solder paste, high temperature solder paste, etc., which are suitable for different microelectronics and semiconductor packaging needs.

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Ultra-Fine Jetting Solder Paste

Jetting solder paste is a high-end product specifically suitable for jet printing. Jet printing is a non-stencil solder spray coating technology, which provides a new process method besides printing and dispensing.

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T8 Ultra-Fine Solder Paste

With the continuous miniaturization of electronic components, the evolving semiconductor packaging is placing newer requirements on packaging solders. For semiconductor packaging solder paste, an important requirement is the ultra-micronization of solder powder.

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T9 Ultra-Fine Solder Paste

T6, T7, T8, T9, and T10 solder powder are called ultra-fine solder powder because of their small particle sizes. Solder paste consisting of T6 to T10 solder powders is called ultra-fine solder paste.

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