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Solder Paste

Solder paste, as an important electronic soldering material, plays a vital role in the electronics manufacturing industry. Its main function is to provide high quality solder connections, reduce oxidation, provide wettability and conductive heat transfer. Fitech solder paste covers a wide range of models and specifications, including ultra-fine solder paste, Gold-tin solder paste, medium temperature solder paste SAC305, low temperature solder paste, high temperature solder paste, etc., which are suitable for different microelectronics and semiconductor packaging needs.

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Lead

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Key Feature

Low-Temperature Lead-Free Solder Paste for Secondary Reflow Soldering

FL170/180/200 Series Micro-Nano Particle Reinforced Low Temperature High Strength Solder

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High-Temperature Leaded Solder Paste

Solder paste with high soldering temperature tends to have better soldering strength. It is suitable for the soldering processes that require high soldering strength. It is also applicable for the first reflow of secondary-reflow soldering.

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High-Temperature Lead-Free Solder Paste

The compositions of alloy and flux in solder pastes are different, leading to different soldering temperatures.

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Low-Temperature High-Reliability Solder Paste

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Low-Temperature Leaded Solder Paste

The compositions of alloy and flux in solder pastes are different, leading to different soldering temperatures.

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