Explain the composition and characteristics of solder paste?

will continue to expand and improve.

Analysis of half-wetting phenomenon in the SMT process

to improve the solderability of the base metal, reduce the presence of contaminants and optimise the welding process parameters.At the same time, appropriate repair measures are required to ensure the quality and reliability of welded joints where half-wetting has already occurred.

What is the difference between a solder pad and an overbore?

the pads and holes in the PCB design and manufacturing each has its unique role and design requirements.Proper understanding and application of them is critical to ensure the performance and reliability of the circuit board.

How long after mixing will solder paste fail if it is not used?

Failure management after solder paste mixing is a key quality control aspect. The following is a detailed analysis and summary of failure management after solder paste mixing:

Analysing the effect of holes in discs and POFV holes

the design of the hole-in-disk and POFV holes has an important impact on the performance and reliability of the printed circuit board.Strict control of the process and quality standards is required during the manufacturing process to ensure that the design of these holes meets the requirements of actual applications and has good reliability and per

Characteristics of tin whisker growth and prevention and control strategies in room temperature environment

we will discuss the growth characteristics of room temperature tin whiskers, analyse the differences in their performance on different substrate materials, and propose effective prevention and control strategies.

How to solve the problem of burrs and tarnish after soldering solder paste?

strengthening the cleaning work, optimising the printing and soldering environment, and improving the level of operating skills.Through the combined application of these measures, soldering quality and product reliability can be significantly improved.

Technical requirements for solder paste for PV?

The technical requirements of solder paste for photovoltaics cover a wide range of aspects such as alloying components, storage properties, printing properties, viscosity characteristics and solder powder.Together, these requirements ensure the quality and reliability of PV modules during the soldering process, thereby improving the performance and