What is wafer microbumping packaging?

Wafer microbumping packaging, more commonly expressed as Wafer Microbumping or Wafer Bumping, is an advanced semiconductor packaging technology.The following is a detailed explanation of Wafer Bumping:

Principle and application method of conductive adhesive

Conductive adhesive, an adhesive that exhibits specific conductive properties after curing or drying, its unique conductive properties and a wide range of application scenarios make it an important and indispensable material in the electronics industry.

The method of preparing fine solder powder (ultra-micro solder powder)

There are various ways to prepare fine solder powder, and five commonly used methods are described below

Analysis of QFN package bridging phenomenon and suggestions for improvement

the causes of QFN package bridging phenomenon mainly include solder extrusion, QFN deformation, and the correspondence between void ratio and bridging.To address these issues, we can reduce the amount of solder paste printed on the inner ring and provide tin space to improve the two aspects.Through reasonable process design and optimisation, we can

Process of solder joint formation in QFN packages

Firstly, due to the smaller size and closer proximity of the peripheral solder joints (i.e. I/O solder joints) to the heat source, they will start to melt earlier than the heat sink pads.This process may cause the QFN package to be slightly lifted locally, but this lifting will gradually disappear as the solder continues to melt.

What are the well-known brands of flux?

Fluxes do play a vital role in the manufacturing industry, especially in the electronics manufacturing industry.There are many of its well-known brands, each of which occupies a place in the market by virtue of its unique advantages and characteristics.Below are some of the well-known flux brands and their characteristics

What are the solder paste viscosity test methods?

There are various methods of solder paste viscosity testing, each with its own specific scope of application, advantages and disadvantages.Below is an overview of several common solder paste viscosity testing methods

Does solder paste expire?

Solder pastes can expire. The shelf life of solder pastes generally ranges from 6 months to 1 year, with finer ultra-micro solder pastes or epoxy pastes having a somewhat broken shelf life of 3-6 months storage life. The specific shelf life can be affected by a variety of factors, including manufacturer's labelling, storage conditions and frequency