Storage and usage of solder paste

Solder paste (solder paste) is a commonly used material in the electronic assembly process, and its storage and use methods are critical to ensuring solder quality and performance. The following are the detailed storage and usage methods:

Comparison of Surface Mount and Through-Hole Technologies

Surface mount technology (SMT) and through-hole insertion technology (THT) are the two main methods of mounting electronic components on printed circuit boards (PCBs).

Corrosion Effecs t of Salt Spray on SAC305 Solder

Electronic products are used in a variety of environments, which requires them to have good reliability in different environments.

Relationship between Laser Soldering Reflectivity and Solder

Fitech is committed to the R&D and sales of electronic-grade solder materials and can provide customers with ultra-fine solder paste and powder (T6 and above).

Advantages of Solder Paste Containing Bismuth compared to SAC305 Solder Paste_Shenzhen Fitech

SAC305 alloy is considered an important metal component of lead-free solder due to its relatively high melting point. Solder joints prepared with SAC305 solder can maintain good condition when subjected to thermal cycles and mechanical stress, so they are of great use in many industries such as the automotive and aerospace industries.

Application of Gold-Tin Solder on Power LED Devices

With the continuous development of LED technology, the luminous efficacy and brightness of LEDs have been improved, especially in the field of solid-state lighting, the market demand for high-power LEDs continues to grow.

Tombstone Effect of Components_Shenzhen Fitech

Component "tombstone" phenomenon in the reflow soldering often occurs, refers to the chip components in the soldering process stand up the situation, also known as "drawbridge" or "Manhattan" phenomenon.

Reflow Solder Bead Causes and Solutions_Shenzhen Fitech

Solder bead is one of the common defects of reflow soldering, the cause is multi-faceted, not only affects the appearance of the solder joints and will cause bridging. Tin beads can be divided into two categories, one appears on the side of the chip components, often a large independent ball; the other appears in the IC pins around, scattered small