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Industry News

Welcome to the Sz Fitech Solder News and Updates page.  Here you’ll find our latest press releases, company announcements, and essential industry news that shapes the modern solder landscape.

Detailed explanation of the production process of solder paste

Detailed explanation of the production process of solder paste

The production process for solder paste is a complex process involving several steps designed to ensure the production of high-quality products for use in surface mount technology (SMT) in the electronics manufacturing industry. The following is a detailed production process:

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Detailed explanation of the standard specifications and applications of tin powder particles

Detailed explanation of the standard specifications and applications of tin powder particles

Tin powder has a wide range of uses and is commonly used as an additive and porous material in powder metallurgy. Tin powder is also used as a high purity reagent in the electronics industry. The particle standard of tin powder is generally reflected by the particle size distribution, particle size,

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How is solder paste made?

How is solder paste made?

The main materials that need to be prepared to make solder paste include tin powder and flux. Among them, tin powder is the main ingredient and flux is the auxiliary ingredient, and they can improve the soldering quality and workmanship.

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What is commonly used to clean flux residue preferably?

What is commonly used to clean flux residue preferably?

The method of cleaning flux residues and the choice of cleaning agent depends on the type of flux, and different fluxes require different cleaning methods.

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Storage and usage of solder paste

Storage and usage of solder paste

Solder paste (solder paste) is a commonly used material in the electronic assembly process, and its storage and use methods are critical to ensuring solder quality and performance. The following are the detailed storage and usage methods:

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Comparison of Surface Mount and Through-Hole Technologies

Comparison of Surface Mount and Through-Hole Technologies

Surface mount technology (SMT) and through-hole insertion technology (THT) are the two main methods of mounting electronic components on printed circuit boards (PCBs).

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Corrosion Effecs t of Salt Spray on SAC305 Solder

Corrosion Effecs t of Salt Spray on SAC305 Solder

Electronic products are used in a variety of environments, which requires them to have good reliability in different environments.

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Relationship between Laser Soldering Reflectivity and Solder

Relationship between Laser Soldering Reflectivity and Solder

Fitech is committed to the R&D and sales of electronic-grade solder materials and can provide customers with ultra-fine solder paste and powder (T6 and above).

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