Improvement of Sn-Bi Low-Temperature Solder Paste by Adding Ag and In
Sn-Bi eutectic solder paste has low soldering temperature requirements and can be soldered at low temperatures. This solder paste is important in the solder market due to its advantages, such as low-temperature soldering and high tensile strength. However, Bi is a brittle metal and prone to segregation in the solder during the heating process. The
Learn MoreHow to improve the mechanical reliability of SAC solder paste
SAC series solder paste is a common medium-temperature solder in semiconductor packaging. This type of solder paste can be used for soldering work at relatively high temperatures, and the strength after soldering is considerable. However, as the thermal stress on the solder joint accumulates, there is a certain degree of deformation between the sol
Learn MoreEpoxy Flux on POP Laminated Packages
For mobile devices such as mobile phones, area array packages such as BGAs, CSPs or POPs are prone to drop failures and need to be reinforced when they are assembled onto printed circuit boards. While underfill is an alternative solution, it increases manufacturing costs and reduces temperature cycling reliability due to the additional curing steps
Learn MoreThermomigration of Solder Joints
What kind of lead-free solder paste should be selected for flip-chip packaging is a problem that needs to be comprehensively considered, including both process conditions and solder paste characteristics. The easiest way to choose a suitable lead-free solder paste for the flip chip is to contact us through the contact information below. Our enginee
Learn MoreCommon Solder Defects and Root Cause Analysis
Voiding occurs in components such as BGA, SGA, QFN, and LGA and increase with a higher reflow temperatures and greater surface tension with lead free alloy. Voiding is affected by the ability of the flux chemistry to effectively (how quickly and how completely) remove surface oxides. As the solvent volatizes, the viscosity of the flux remnant incr
Learn MoreBrief Reflow Profiles Analysis
The rapid cooling phase will lead to a fine grain structure. The limiting factor for the maximum cooling rate is the stress that is exerted on the solder joint if the rate is too fast due to the different CTE of components involved. A cooling rate of ~4°C/second is normal.
Learn MoreWhat Kind of Solder Paste is Selected for Flip Chip Package?
What kind of lead-free solder paste should be selected for flip-chip packaging is a problem that needs to be comprehensively considered, including both process conditions and solder paste characteristics. The easiest way to choose a suitable lead-free solder paste for the flip chip is to contact us through the contact information below. Our enginee
Learn MoreSolder Paste for MEMS Package: Atomic Layer Deposition Process Assists PowderMEMS
Solder Paste and Ultra-Fine Solder Manufacturer-Shenzhen Fitech is a comprehensive solder paste supplier integrating production, sales, research, and service of solder paste, epoxy solder paste, and solder powder. Fitech is the leading unit for the formulation of solder powder standards of the Ministry of Industry and Information Technology. Fitech
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