High-Temperature solder on Flip Chips and Low-Temperature Solder Paste on Laminate Substrates

Flip-chip interconnection technology has been widely used in high-performance and consumer electronics. High-performance packaging has achieved steady development, realizing the interconnection with more than 10,000 I/Os and a pitch of less than 200um, realizing the transition from ceramic substrates to low-cost organic substrates, and achieving th

The Evolution of Intermetallic Compounds during Laser Soldering

With the advent of the post-Moore era, electronic components are gradually developing in the direction of miniaturization, complex structure, and functional integration. Laser soldering has become popular for improving soldering processes with its unique advantages of non-contact, selective local heating, and high precision. What we know is that la

Detailed explanation of the solder paste process in the dropped pieces and solder ball problem

In the electronic assembly process, dropped parts and solder balls are common quality problems, they have a direct impact on the reliability and performance of the product.

Analysis of the causes and hazards of tin bead defects

Tin beads are formed during the soldering process, when there are solder paste printing defects, solder paste collapses or is pressed out of the pad by the SMD device, after re-flow, in the side of the component or stay under the component to form a tin bead. It is similar to the solder ball, but the size is very large, usually in the huge chip com

Is leaded or lead-free solder paste better?

The choice of solder paste, the comparison between leaded and lead-free solder paste, depends on a number of factors such as specific application scenarios, environmental requirements, cost considerations and soldering results. The following is a detailed analysis of the advantages and disadvantages of the two and the process and so on

How to set the conditions for acceptable solder paste printing graphics?

Fine-pitch components (e.g. QFN, BGA, etc.) have extremely high requirements for solder paste uniformity, thickness and edge definition due to their small pin spacing. Any minor printing defects can lead to poor soldering, such as bridging, open circuits or empty soldering. Therefore, these special requirements must be fully taken into account when

Under-tin and under-printing in the SMT process

The phenomena of less tin and missed prints in the SMT (Surface Mount Technology) process are common quality problems, and they have an important impact on the quality and reliability of products. The following is a detailed analysis of these two phenomena

Furnace Temperature Profile Design and Solutions

Furnace temperature profile design is a complex and critical process, which directly affects product quality and production efficiency. In the design of the temperature curve, the following aspects need to be noted: