How to solve the problem of burrs and tarnish after soldering solder paste?

strengthening the cleaning work, optimising the printing and soldering environment, and improving the level of operating skills.Through the combined application of these measures, soldering quality and product reliability can be significantly improved.

Technical requirements for solder paste for PV?

The technical requirements of solder paste for photovoltaics cover a wide range of aspects such as alloying components, storage properties, printing properties, viscosity characteristics and solder powder.Together, these requirements ensure the quality and reliability of PV modules during the soldering process, thereby improving the performance and

Is spray solder paste, spray printing solder paste the same?

njected solder paste and printed solder paste essentially refer to the same technology or process whereby solder paste is precisely coated or deposited onto a specified substrate using a jetting process.The spray printing process utilises high-speed jetting valves to precisely deposit tiny droplets of solder paste onto PCB pads with high accuracy,

What are the China domestic solder paste brands?

It should be noted that the brands listed above are only some of the well-known solder paste brands and do not represent all of them.When choosing a solder paste brand, it is recommended to consider the specific application scenarios, performance requirements and budget and other factors.

What is the difference between flux paste and flux?

In general, there are differences between flux paste and flux in terms of appearance, main components and functions, usage and application scenarios.When choosing which flux material to use, the decision should be based on specific soldering needs and process requirements.

Solder leakage problems and improvement strategies in electronics manufacturing

To sum up, by comprehensively applying a variety of improvement measures and supplementary measures, the leakage welding problem can be solved more effectively and the overall quality and reliability of electronic manufacturing can be enhanced.

What is the difference between Fine solder powder and ultra-fine solder powder?

SiP system level packaging and other semiconductor fields have been rapid development, and has gained the praise of users in the industry. Overall, Fine solder powder and ultra-micro solder powder have obvious differences in particle size, performance and application. Fitech's ultra-fine solder powder has a wide range of applications in microelectr

How to effectively reduce the cost of using solder paste?

Quality testing and reuse criteria: The recycled solder paste is tested for quality, including viscosity, metal composition content, flux activity, etc. According to the test results, appropriate process adjustments are made to the recycled solder paste, such as increasing the printing pressure or slowing down the printing speed to ensure the print