Analysis of SAC305 solder paste and its function

SAC305 solder paste is a lead-free solder, specially developed to adapt to environmental protection requirements and meet the RoHS and REACH requirements of the European Union. It is mainly composed of tin-silver-copper alloy (containing 96.5% tin, 3% silver and 0.5% copper) and flux, the melting temperature of the alloy is 217 degrees Celsius, and

PCBA Conformal Coating Process Corrosion Failure Analysis

Conformal coating, refers to the addition of a layer of protective coating to protect products and improve product reliability, three-proof paint plays a role in isolating electronic components and circuit boards from harsh environments.

The Effect of Ag Content on the Reliability of SnBi Solder LED Package

Light-emitting diodes (LEDs), as a new type of lighting and display technology with high efficiency, small size, long life and low power consumption, are widely used in a variety of fields such as household lighting, automotive indicator lights, avionics and display backlighting units, etc.

Underfill Process on Flip Chips

Flip chip (FC) technology is a packaging method in which the chip is directly attached to the substrate, which has the advantages of high density, high performance and low cost.

Comparison of Surface Mount and Through-Hole Technologies

Surface mount technology (SMT) and through-hole insertion technology (THT) are the two main methods of mounting electronic components on printed circuit boards (PCBs).

Corrosion Effecs t of Salt Spray on SAC305 Solder

Electronic products are used in a variety of environments, which requires them to have good reliability in different environments.

Relationship between Laser Soldering Reflectivity and Solder

Fitech is committed to the R&D and sales of electronic-grade solder materials and can provide customers with ultra-fine solder paste and powder (T6 and above).

Shenzhen Fitech was invited to participate in 2024 Global CMOS Sensor Application Technology Summit

On April 17, 2024, Fitech was invited to participate in the Global CMOS Sensor Application Technology Summit. Thank you for your presence during this time!