How to improve the solder creep of solder paste during the soldering process?

To improve the solder paste in the printing process to climb tin need to be from the solder paste selection and processing, printing process optimisation, PCB boards and components preparation, environmental control and operational specifications, as well as subsequent welding process with a number of aspects.Through comprehensive consideration of

Difference between solid crystal solder paste and normal solder paste

there are significant differences between solid crystal solder paste and ordinary solder paste in terms of composition and particle size, packaging and storage, use and process, and performance requirements.When choosing to use, you need to choose according to the specific application scenarios and soldering requirements.

Improvement of Sn-Bi Low-Temperature Solder Paste by Adding Ag and In

Sn-Bi eutectic solder paste has low soldering temperature requirements and can be soldered at low temperatures. This solder paste is important in the solder market due to its advantages, such as low-temperature soldering and high tensile strength. However, Bi is a brittle metal and prone to segregation in the solder during the heating process. The

How to improve the mechanical reliability of SAC solder paste

SAC series solder paste is a common medium-temperature solder in semiconductor packaging. This type of solder paste can be used for soldering work at relatively high temperatures, and the strength after soldering is considerable. However, as the thermal stress on the solder joint accumulates, there is a certain degree of deformation between the sol

Epoxy Flux on POP Laminated Packages

For mobile devices such as mobile phones, area array packages such as BGAs, CSPs or POPs are prone to drop failures and need to be reinforced when they are assembled onto printed circuit boards. While underfill is an alternative solution, it increases manufacturing costs and reduces temperature cycling reliability due to the additional curing steps

Thermomigration of Solder Joints

What kind of lead-free solder paste should be selected for flip-chip packaging is a problem that needs to be comprehensively considered, including both process conditions and solder paste characteristics. The easiest way to choose a suitable lead-free solder paste for the flip chip is to contact us through the contact information below. Our enginee

Common Solder Defects and Root Cause Analysis

Voiding occurs in components such as BGA, SGA, QFN, and LGA and increase with a higher reflow temperatures and greater surface tension with lead free alloy. Voiding is affected by the ability of the flux chemistry to effectively (how quickly and how completely) remove surface oxides. As the solvent volatizes, the viscosity of the flux remnant incr

Brief Reflow Profiles Analysis

The rapid cooling phase will lead to a fine grain structure. The limiting factor for the maximum cooling rate is the stress that is exerted on the solder joint if the rate is too fast due to the different CTE of components involved. A cooling rate of ~4°C/second is normal.