What are the factors that affect the reliability of lead-free solder joints?

Lead-free soldering does present some solder joint reliability challenges relative to traditional lead (Pb) containing processes. This stems mainly from the differences between Pb-free brazing materials and traditional brazing materials, as well as the adjustment of process parameters. So what are the specific factors that affect the reliability of

Formation of Solder Joints during BGA Reflow Soldering

The formation of solder joints during BGA (Ball Grid Array) reflow soldering is a complex and delicate process that involves a number of phases, including preheating, solder melting, ball collapsing, auto-alignment, and so on. The following is a detailed analysis of the process:

Lead-free brazing alloy properties summary

What is lead-free solder? Lead-free solder (Pb-free solder) means that the chemical composition of the solder does not contain lead (Pb), and the Rohs Directive requires that the Pb content does not exceed 1000 PPM, or 0.1%. The main representative of Pb-free solder is tin-based solder, and the most used Pb-free solder is tin-silver-copper Pb-free

Tin whisker phenomenon in electronic packaging and its control strategy

Tin whiskers are elongated, needle-like single crystals of tin that form spontaneously on the surface of pure tin (Sn) or tin-containing alloys. These whiskers are usually only a few microns in diameter, but can be several millimetres or even more than 10 millimetres long, which can cause serious reliability problems. The following is a comprehensi

Which is better, flux or rosin?

Flux and rosin each have their own characteristics and advantages in the soldering process, the choice of which is better to use needs to be based on specific application scenarios to decide.

Wetting reactions of lead-free eutectic solders in the metallisation layer under thick Cu bumps

The wetting reaction of a lead-free eutectic solder to a metallised layer under a thick Cu bump involves a number of aspects, and the following is a detailed analysis of the process:

Difference between flux and solder paste

Fluxes and flux pastes both play an important role in the soldering process, but there are some distinct differences in their composition, use, form, and application scenarios.

What are the advantages of ultrafine tin powder?

Ultrafine tin powder is ultrafine solder powder with particle size model above T6 (5~15μm), including T6 (5~15μm), T7 (2~11μm), T8 (2~8μm), T9 (1~5μm), T10 (1~3μm) and other models of ultrafine tin powder. Ultra micro tin powder is the key material for microelectronics and semiconductor packaging, precision device packaging.