Microstructure and mechanical properties of solder joints

There is a strong link between the microstructure and the mechanical properties of the solder joints, such as the cooling rate, creep and fatigue properties, as well as the lead-free alloy properties have a large impact on the solder joint properties. The following are some analyses and further explanations:

The Impacts of Laser and Reflow Soldering on Solder Joints

With the advent of the "post-Moore era", heterogeneous integration based on small chips will become the mainstream of semiconductor packaging. Small chips tend to be packaged in 3D directions to achieve flexible modular integration and system-on-chip integration. It should be considered that 3D packaging will bring some problems. For example, high-

Corrosion Effecst of Salt Spray on SAC305 Solder

Electronic products are used in a variety of environments, which requires them to have good reliability in different environments. The reliability of electronic products is reflected in the solder joints. Solder joints with low reliability are easily weakened by temperature, humidity, stress, and other factors, eventually leading to damage to elect

High-Temperature solder on Flip Chips and Low-Temperature Solder Paste on Laminate Substrates

Flip-chip interconnection technology has been widely used in high-performance and consumer electronics. High-performance packaging has achieved steady development, realizing the interconnection with more than 10,000 I/Os and a pitch of less than 200um, realizing the transition from ceramic substrates to low-cost organic substrates, and achieving th

The Evolution of Intermetallic Compounds during Laser Soldering

With the advent of the post-Moore era, electronic components are gradually developing in the direction of miniaturization, complex structure, and functional integration. Laser soldering has become popular for improving soldering processes with its unique advantages of non-contact, selective local heating, and high precision. What we know is that la

Detailed explanation of the solder paste process in the dropped pieces and solder ball problem

In the electronic assembly process, dropped parts and solder balls are common quality problems, they have a direct impact on the reliability and performance of the product.

Analysis of the causes and hazards of tin bead defects

Tin beads are formed during the soldering process, when there are solder paste printing defects, solder paste collapses or is pressed out of the pad by the SMD device, after re-flow, in the side of the component or stay under the component to form a tin bead. It is similar to the solder ball, but the size is very large, usually in the huge chip com

Is leaded or lead-free solder paste better?

The choice of solder paste, the comparison between leaded and lead-free solder paste, depends on a number of factors such as specific application scenarios, environmental requirements, cost considerations and soldering results. The following is a detailed analysis of the advantages and disadvantages of the two and the process and so on