What is the difference between Fine solder powder and ultra-fine solder powder?

Fine solder powder and ultra-micro solder powder mainly differ in particle size, and this difference in particle size also affects their application scenarios and performance. The following is a detailed comparison of the two, with an introduction to Fitech ultra-fine solder powder:

I. Difference between Fine solder powder and ultra-fine solder powder
Particle size:

Fine solder powder: usually refers to solder powder with relatively small particle size, but the exact particle size range may vary according to different standards and production processes.

Ultrafine Solder Powder: then refers to solder powder with even smaller particle size. According to the classification of T series, the particle size models of Ultrafine Solder Powder are in the range of T6 (5~15 μm) and above, including the models of T7 (2~11 μm), T8 (2-8 μm), T9 (1~5 μm), T10 (1~3 μm) and so on.

Performance and Applications:

Due to the difference in particle size, ultramicro solder powders are usually more stable in physical and chemical properties, with higher welding activity and better flowability.This gives ultramicro solder powders a greater advantage in application scenarios that require high precision and reliability, such as microelectronics and semiconductor packaging and precision device packaging.

In contrast, Fine solder powders, while also offering high performance, may not be able to fully meet the needs in certain application scenarios where particle size is critical.

The T8~T10 ultra-micro solder powder launched by Fitech is a key material in the field of microelectronics and semiconductor packaging. The powder adopts Fitech patented powder making technology - liquid phase forming spherical alloy powder preparation technology, which applies the principle of ultrasonic cavitation effect, and can be used for the preparation of ultra-fine solder powder above T6 (5~15μm) and has been mass-produced on a large scale (the capacity of each hour reaches 40kg, and the annual production capacity can be up to 160t).

The T8~T10 ultramicro solder powder prepared by liquid phase forming technology has the following advantages:

Fine particle size and uniform distribution: the average particle size of ultra-micro tin powder is between a few microns and ten microns, with uniform particle size distribution, making its physical and chemical properties more stable.

High sphericity: the true roundness is up to 100%, the tin is smoother, ensuring the stability of printing and dispensing performance.

Low oxygen content: the solder powder surface adopts coating technology, which reduces the oxygen content and improves the stability and reliability of the product.

Various alloy models available: A variety of alloy models, low temperature (melting temperature 139°C) and medium-high temperature (219~245°C) ultra-micro solder powders can be prepared to meet the needs of different application scenarios.

Fitech's T8~T10 ultra-micro solder powder has been widely used in SMT, solid crystal, micro-bump, narrow pitch, dispensing, spray printing, laser soldering and other solder paste products, and with the development of microelectronics and semiconductor packaging technology, its application areas are becoming more and more extensive. Currently has been in the micro-optical display, automotive electronics, Internet of Things, mobile phone communications and other consumer electronics, SiP system level packaging and other semiconductor fields have been rapid development, and has gained the praise of users in the industry.

Overall, Fine solder powder and ultra-micro solder powder have obvious differences in particle size, performance and application. Fitech's ultra-fine solder powder has a wide range of applications in microelectronics and semiconductor packaging with its unique preparation technology and excellent performance.