Solder adhesive, also known as epoxy solder paste, is widely used in SMT precision microelectronic component soldering, semiconductor packaging, chip packaging, LED die bond packaging, FPC flexible products, camera modules, and other fine soldering fields due to its unique advantages.Fitech's epoxy solder paste products are advanced soldering materials formulated by combining alloy solder powder known for its exceptional sphericity, uniform particle size, low oxygen content and high strength, with a halogen-free flux. These products are recognized for their non-cleaning characteristics, superior corrosion resistance and excellent insulation properties, making them an innovative choice in electronic packaging. They are available in a range of alloys tailored for applications across low to medium-high temperatures, covering particle size categories from T4 to T10 to meet various operational needs effectively.