Designed for soldering applications requiring soft brazing temperatures lower than conventional lead-free solder alloys, typically around 150°C to 200°C, Low-Temperature solder pastes provide excellent wetting and adhesion at lower temperatures to ensure reliable solder joints while minimizing thermal stress on sensitive components, which reduces the risk of component damage and warpage during assembly. It is suitable for electronic assemblies involving heat-sensitive materials such as plastics, and for applications requiring energy-efficient soldering processes.