Low-Temperature High-Reliability Solder Paste-FSA-170D

The main alloy component of  FSA-170D series epoxy solder paste is Fitech’s FL170 low-temperature alloy solder powder (SnBiAgX).  Fitech classifies FL170 solder powders into T4 to T7 based on particle sizes. The solder powder and epoxy-based flux are formulated into superior low-temperature high-reliability solder paste.

1. Excellent sphericity, uniform particle size, low oxygen content, and high strength;

2. Reduce solvent volatilization during the curing process;

3. Halogen-free, no clean；
4. Reduce solder ball formation after soldering;

5. The solder joints are metallurgically connected, which are equivalent to the soldering effects of solder paste;

6. The soldering residue becomes thermosetting adhesive, which is attached around the solder joint to improve its strength and enhance the anti-corrosion and insulation performance;

7. It is suitable for reliable packaging of thin substrates and non-heat-resistant components.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Stencil Cleaning Solvent: Ether. Propylene glycol monomethyl ether (PM) is preferred.