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Solder Paste for Multiple Reflow Soldering

Solder paste for multiple reflow soldering features moderate viscosity, excellent flowability at high temperatures, low oxidation rates, environmental friendliness with halogen-free formulations and versatility across various electronic components, enhancing production efficiency and ensuring soldering quality.

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FILTERS

Melting Point Temperature

Type

Halogen

Lead

Silver

Key Feature

High-Temperature Solder Paste for Multiple Reflow Soldering

High-temperature lead-free solder paste is a lead-free solder paste with a minimum alloy melting point of 260°C, which is suitable for multiple reflow soldering of power semiconductor packaging and microelectronic packaging.

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Low-Temperature Lead-Free Solder Paste for Secondary Reflow Soldering

FL170/180/200 Series Micro-Nano Particle Reinforced Low Temperature High Strength Solder

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