Laser solder paste used for laser soldering is suitable for camera modules, FPC flexible circuit boards, thermal devices, MEMS, and other scenarios that must be locally heated and soldered. Laser soldering is a fast heating and cooling localized soldering process that requires the use of laser solder pastes to prevent solder explosions, spattering and solder ball formation, which makes it necessary for laser solder pastes to produce excellent wetted joints within very short soldering times (below 3s).

Fitech's laser solder paste meets the requirements of rapid soldering. Meanwhile, it can eliminate solder detonation, solder splashing, and solder ball formation to ensure soldering reliability. Laser solder paste adopts ROSH-compliant halogen-free formulation.