Low Temperature Laser Solder Paste

Low-temperature FL170 alloy solder powder with good sphericity, uniform particle size, low oxygen content, and high strength are combined with halogen-free flux to produce FTD-170 series low-temperature solder paste. Only a small amount of solvent volatilizes during the soldering process. There is no solder ball formation after soldering. The solder paste has excellent performance of residue minimization and wettability. The solder joints generated are strong, plump, and bright. FTD-170 is ideal for low-temperature soldering, especially for low-temperature component mounting.

1. Storage and Recovery Instruction: Solder paste is normally stored in a refrigerator with -5~10℃. When solder paste is taken out of the cold box,its temperature is much lower than room temperature. If use without the recovery process varies damage may be caused to the paste. Opening the cap of sealing may cause water vapor in the air to condense on the paste. If this occurs, later in the reflow furnace (temperature over 150 ℃ ), water would vaporize due to strong heat.This may lead to solder explosion and damage the chip.

2. Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

3. Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

4. Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.
5. Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

6. Operating Time

① Continuous printing time: When adding solder paste continuously: 8 hours; In case of discontinuous addition of solder paste: 4 hours; ② Please add solder paste before the solder paste on the board is almost one third (rolling diameter: 10mm or less); ③ Please keep the solder paste on the plate within 3 hours; ④ If printing is interrupted for more than 30 minutes, please clean the stencil. ⑤ Dwell time after printing: After the solder paste is printed, the components should be mounted as soon as possible and the soldering should be completed when passing the oven to avoid drying out the surface of the solder paste due to long storage, which will affect the component mounting and soldering effects. Generally, the recommended dwell time of solder paste is no more than 4 hours, while the low-temperature bismuth-containing solder paste does not exceed 2 hours. If the printing is interrupted for more than 30 minutes or is temporarily interrupted, the printing template needs to be cleaned. It can continue to work after 1-2 trial printing. The solder paste attached to the narrow space of the opening (≤0.4mm) and the opening of the stencil will gradually dry, which will degenerate the adhesive ability.