What is the difference between solid crystal solder paste and conventional SMT solder paste?

If confused use (such as solid crystal with SMT solder paste), may lead to heat damage to the chip or bonding strength is insufficient; Conversely, solid crystal solder paste welding components may be due to poor wettability resulting in poor welding.

Difference between BGA flux paste and normal flux paste?

There are significant differences between BGA flux paste and ordinary flux paste, mainly in the following aspects:

What can I do to fix dry solder paste?

What is the difference between laser solder paste and regular solder paste?

The difference between laser solder paste and ordinary solder paste is mainly reflected in its composition, soldering mechanism, performance advantages and application areas, the following is a more detailed analysis:

Mechanism of Intermetallic Compound Formation

Intermetallic compounds are a class of substances formed by chemical bonding of metallic elements in specific atomic proportions.

PCBA Conformal Coating Process Corrosion Failure Analysis

Conformal coating, refers to the addition of a layer of protective coating to protect products and improve product reliability, three-proof paint plays a role in isolating electronic components and circuit boards from harsh environments.

The Effect of Ag Content on the Reliability of SnBi Solder LED Package

Light-emitting diodes (LEDs), as a new type of lighting and display technology with high efficiency, small size, long life and low power consumption, are widely used in a variety of fields such as household lighting, automotive indicator lights, avionics and display backlighting units, etc.

Underfill Process on Flip Chips

Flip chip (FC) technology is a packaging method in which the chip is directly attached to the substrate, which has the advantages of high density, high performance and low cost.