Difference between BGA flux paste and normal flux paste?

There are significant differences between BGA flux paste and ordinary flux paste, mainly in the following aspects:

1. Composition and Design Objectives

BGA Flux Pastes: are usually designed based on the requirement for lead-free soldering, so they do not contain lead in their composition and usually have a higher melting point and a longer melting range for soldering BGA (Ball Grid Array) chips.In addition, BGA flux pastes typically have a higher viscosity to keep solder balls in the correct position and prevent them from slipping.

General Flux Paste: May contain lead or other alloys for different soldering needs.General flux pastes typically have a lower melting point and shorter melting range, and may have a lower viscosity, making them more suitable for other soldering applications.

2. Performance Characteristics

BGA Flux Paste:

Wettability and Coverage: Since the solder balls on BGA chips are usually small, BGA flux paste usually has better wettability and coverage to ensure that the solder balls are properly protected and covered.

Environmental performance: Since they are designed for lead-free soldering, BGA flux pastes usually have high environmental performance and meet the requirements of environmental protection.

Common Flux Paste:

Protection performance: Compared to BGA flux paste, ordinary flux paste may have weaker protection performance.

Environmental standards: may contain lead and other environmental pollutants, not necessarily in line with environmental standards such as halogen-free.

3. Application

BGA flux paste: designed for the BGA package welding process, suitable for mobile phone chip repair, component welding and other needs of high reliability and fine welding occasions.

General flux paste: suitable for general welding applications, especially the use of traditional lead soldering process occasions.

4. specific product examples

BGA flux paste: such as Fuyinda BGA flux paste, with environmental protection, lead-free and halogen-free, excellent paste fluidity, good adhesion, strong welding ability, etc., suitable for mobile phone repair BGA soldering as well as mini, micro-LED crystal stabbing and other occasions.

Ordinary flux paste: may contain common rosin film-forming agent and ionic active agent, the residue after welding may be easy to yellow, sticky hands, and may lead to corrosion of the welded product, leakage and other undesirable phenomena.

To sum up, there are significant differences between BGA flux paste and common flux paste in terms of composition, performance characteristics, application occasions, and so on.When choosing flux paste, you need to choose the right product according to the specific welding needs and application scenarios.