Low-temperature metallurgical-connection halogen-free anisotropic conductive paste is used to manufacture touch screens, smart cards, radio frequency identifications (RFID), flip chips, flexible printed circuits (FPC), and other products. It applies to the assembly and packaging of microelectronic circuits with ultra-fine pitch and is accelerating the miniaturization of microelectronic packaging. It is used in soldering on two fine-pitch conductive connection points in the manufacturing process of electronic components to avoid short circuits and improve the product's yields.