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Ultra-Fine Solder Powder

Ultra-fine solder powder refers to T6 to T10 solder powder based on alloy particle sizes. With the development of microelectronics and semiconductor packaging technology, electronic-grade packaging has been widely applied. At present, ultra-fine solder powder is developed to adapt to the upgrade of the microscopic electric display, automotive electronics, Internet of Things, consumer electronics, SiP, and other fields.

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Ultra Fine Solder Powder

Fitech is the world's leading supplier of ultra-fine solder powder and is the only packaging material supplier that can produce T2 to T10 electronic-grade solders.

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