Ultra-Fine Printing Solder Paste

FH260 solder powder with excellent sphericity, uniform particle size, and low oxygen content is combined with halogen-free flux to produce FH-260P series solder paste. It is a high-temperature lead-free product developed for secondary reflow of power semiconductor and microelectronic packaging. FH-260 is synthesized based on bismuth elements by adding reinforced micro/nanoparticles, which successfully replaces high-lead solder paste and meets RoHS environmental protection standards.

Temperature(200°C)    Water-Soluble

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste

Operation Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

FTP-0176 printing solder paste adopts SnCuX silver-free formulation, eliminating the impact of silver migration.SnCuX silver-free solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with halogen-free flux to produce FTP-0176 series solder paste. The solder paste has a superior tackiness effect before soldering and less solvent volatilization during soldering. Moreover, the solder paste has excellent wettability, anti-collapse and less residual performance.FTP-0176 is suitable for micro-bump ultra-fine-pitch soldering.

1. Wide window period for printing process;

2. No silver migration effect and fewer residue generation;

3. FTP-0176 adopts ultra-fine solder powder formulation with narrow particle size distribution, which ensures stable solder paste release performance;

4. It has outstanding thixotropy and appropriate viscosity;

5. Excellent chemical activity, satellite solder ball elimination, and good wettability;

6. The operation is simple. Reflow furnaces, electric heating plates, ovens, and other heating devices can be used.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

The FTP-125 can refine the IMCs, which allows a better soldering strength, fewer residues, and excellent wettability. The SAC125 (SnAgCuNi) solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with halogen-free flux to produce FTP-125 printing solder paste. The solder paste has a superior tackiness effect before soldering and less solvent volatilization during soldering. Moreover, the solder paste has excellent satellite solder ball inhibition, anti-collapse and less residual performance.FTP-125 is suitable for micro-bump ultra-fine-pitch soldering.

1. Wide window period for solder paste printing process;

2. Reduced soldering residues and excellent wettability;

3. FTP-125 can refine the IMCs, leading to superior aging performance;

4. FTP-125 has narrow particle size distribution, excellent solder release performance, and extraordinary anti-slump effect, which is ideal for ultra-fine-pitch soldering;

5. Excellent chemical activity, satellite solder ball elimination, and good wettability;

6. The operation is simple. Reflow furnaces, electric heating plates, ovens, and other heating devices can be used;

7. Good thixotropy, proper viscosity, superior stability, no stratification, and long working life.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Low-temperature FL170 alloy solder powder with excellent sphericity, uniform particle size, low oxygen content, and high strength are combined with halogen-free flux to produce FTP-170 series low-temperature solder paste. Only a small amount of solvent volatilizes during the soldering process. There is no solder ball formation after soldering. In addition, FTP-170 has an excellent performance in residue minimization and wettability. The solder joints generated are strong, plump, and bright. The product is ideal for low-temperature soldering, especially for low-temperature component mounting.

1、Storage and Recovery Instruction: Solder paste is normally stored in a refrigerator with -5~10℃. When solder paste is taken out of the cold box,its temperature is much lower than room temperature. If use without the recovery process varies damage may be caused to the paste. Opening the cap of sealing may cause water vapor in the air to condense on the paste. If this occurs, later in the reflow furnace (temperature over 150 ℃ ), water would vaporize due to strong heat.This may lead to solder explosion and damage the chip.

2、Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

3、Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

4. Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste

5. Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

6. Operating Time

① Continuous printing time: When adding solder paste continuously: 8 hours; In case of discontinuous addition of solder paste: 4 hours; ② Please add solder paste before the solder paste on the board is almost one third (rolling diameter: 10mm or less); ③ Please keep the solder paste on the plate within 3 hours; ④ If printing is interrupted for more than 30 minutes, please clean the stencil. ⑤ Dwell time after printing: After the solder paste is printed, the components should be mounted as soon as possible and the soldering should be completed when passing the oven to avoid drying out the surface of the solder paste due to long storage, which will affect the component mounting and soldering effects. Generally, the recommended dwell time of solder paste is no more than 4 hours, while the low temperature bismuth-containing solder paste does not exceed 2 hours. If the printing is interrupted for more than 30 minutes or is temporarily interrupted, the printing template needs to be cleaned. It can continue to work after 1-2 trial printing. The solder paste attached to narrow space of the opening (≤0.4mm) and the opening of the stencil will gradually dry, which will degenerate the adhesive ability.

Fitech produces SAC305 solder powder with excellent sphericity, uniform particle size, and low oxygen content, and it is mixed with halogen-free flux to prepare FTP-305 series solder paste. The solder paste has a superior adhesion effect before soldering. Solvent volatilizes very slightly during soldering. Moreover, FTP-305 has outstanding wettability, anti-slump, anti-collapse and less residual performance.There is no solder ball formation during soldering. The product is ideal for micro-bump ultra-fine-pitch packaging.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Fitech's tin-bismuth-silver alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with excellent halogen-free flux to prepare FTP-574 series low-temperature solder paste. Solvent volatilizes very slightly during soldering. There is no solder ball formation and only a small amount of residue forms after soldering. Moreover, the product has outstanding wettability, and the solder joints generated are plump and bright. It is effective for low-temperature component mounting. 

1、Storage and Recovery Instruction: Solder paste is normally stored in a refrigerator with -5~10℃. When solder paste is taken out of the cold box,its temperature is much lower than room temperature. If use without the recovery process varies damage may be caused to the paste. Opening the cap of sealing may cause water vapor in the air to condense on the paste. If this occurs, later in the reflow furnace (temperature over 150 ℃ ), water would vaporize due to strong heat.This may lead to solder explosion and damage the chip.

2、Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

3、Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

4. Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.

5. Operating Environment:The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

6. Operating Time

① Continuous printing time: When adding solder paste continuously: 8 hours; In case of discontinuous addition of solder paste: 4 hours; ② Please add solder paste before the solder paste on the board is almost one third (rolling diameter: 10mm or less); ③ Please keep the solder paste on the plate within 3 hours; ④ If printing is interrupted for more than 30 minutes, please clean the stencil. ⑤ Dwell time after printing: After the solder paste is printed, the components should be mounted as soon as possible and the soldering should be completed when passing the oven to avoid drying out the surface of the solder paste due to long storage, which will affect the component mounting and soldering effects. Generally, the recommended dwell time of solder paste is no more than 4 hours, while the low temperature bismuth-containing solder paste does not exceed 2 hours. If the printing is interrupted for more than 30 minutes or is temporarily interrupted, the printing template needs to be cleaned. It can continue to work after 1-2 trial printing. The solder paste attached to narrow space of the opening (≤0.4mm) and the opening of the stencil will gradually dry, which will degenerate the adhesive ability.

SnSb10 alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with no-clean flux to produce FTP-901 series solder paste based on metallurgical method and chemical structure. FTP-901 has a superior adhesion effect before soldering. Solvent volatilizes very slightly during soldering. Moreover, FTP-901 has outstanding wettability, anti-collapse and less residual performance.It is developed to meet the marketing demand for heat-resistant microelectronic device assembly and precision soldering. The product has extraordinary heat resistance and heat dissipation abilities. It also improves soldering voiding and the strength and conductivity of intermetallic compounds.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.

Operation Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

The main alloy of FWS-305P water-based solder paste is tin-silver-copper (SAC305). The  water-based solder paste product is prepared by mixing T5, T6, T7, or T8 alloy powder with halogen-free environmental-protection flux. solder paste is tin-silver-copper (SAC305). The  solder paste product is prepared by mixing T5, T6, T7, or T8 alloy powder with halogen-free environmental-protection flux.

1. The alloy has excellent sphericity, uniform particle size, and low oxygen content;
2. Outstanding halogen-free flux is used;
3. It has superior adhesion performance before soldering;
4. The solder paste has excellent viscosity stability and superior stencil life;
5. It is an ideal solder with extraordinary water cleaning performance for high-reliability micro-bump ultra-fine-pitch packaging.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.Recovery 

time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.
Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-55%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Cleaning Instruction: There is a small amount of residue around the pad after reflow, which should be cleaned with deionized water as soon as possible. The temperature of deionized water is between 25 and 40℃.