Products Description
Product Documentation
FTP-305
Description
Properties
Instructions
Fitech produces SAC305 solder powder with excellent sphericity, uniform particle size, and low oxygen content, and it is mixed with halogen-free flux to prepare FTP-305 series solder paste. The solder paste has a superior adhesion effect before soldering. Solvent volatilizes very slightly during soldering. Moreover, FTP-305 has outstanding wettability, anti-slump, anti-collapse and less residual performance.There is no solder ball formation during soldering. The product is ideal for micro-bump ultra-fine-pitch packaging.
Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.
Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.
Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.
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