Solder Joint Improvement by Flux Doped with Cu-Modified Carbon Nanotubes _Fitech Solder Paste

Flux is one of the components of solder paste, which plays the role of removing oxides and improving the wettability of solder paste. However, even if different types of fluxes are used

Effects of Bismuth Doping on SAC305-xBi Medium-Temperature Solder Paste

Medium-temperature SAC305 solder paste was developed to replace Sn63Bi37 leaded solder paste. Although the melting point of SAC305 solder paste is slightly higher than that of Sn63Bi37 solder paste

Application of epoxy solder paste to improve the solder strength of chip soldering

Chip soldering is the process of soldering a chip to a circuit board. Solder strength is the maximum load that the soldered joint can withstand and it is very important for chip soldering.