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Solder Powder

Solder powder is a kind of connecting material used in electronic industry, which is mainly composed of Sn (tin) and other metals (such as Pb, Ag, Cu, etc.) as alloy powder. Fitech solder powder adopts Fitech's patented powder making technology - liquid phase molding spherical alloy powder technology, which applies the principle of ultrasonic cavitation effect, and can be used for the preparation of ultra-fine solder powder  T6 (5~15μm)， T7(2~11μm)，T8 (2~8μm)，T9 (1~5μm)，T10 (1~3μm)，and has already been mass-produced on a large scale. This technology enables the solder powder to have excellent sphericity and low oxygen content, which ensures the stability and reliability of the welding process.

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SMT Solder Powder

The ordinary SMT solder powder produced by Fitech covers various alloys such as Sn-Pb alloy, Sn-Bi(Ag)​ alloy, Sn-Sb alloy,and Sn-Ag-Cu alloy.

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Ultra Fine Solder Powder

Fitech is the world's leading supplier of ultra-fine solder powder and is the only packaging material supplier that can produce T2 to T10 electronic-grade solders.

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Low Alpha Solder Powder

Low Alpha Solder Powder

Low Alpha Solder Powder

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Gold-Tin Soldering Powder

Gold-Tin soldering powder, also known as AuSn solder, is renowned for its exceptional reliability in high-performance electronic packaging and semiconductor applications. Composed of a precise ratio of gold (Au) and tin (Sn),

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