Melting Point
Composition
Mechanical Property
Physical Property
Reliability
SPECTRO Spark OES MAXX06
Chemical Component Detection
Digital Micro-Vickers Hardness Tester HVS-1000
Material Hardness Testing
ICP-OES 7000DV
Chemical Component Analysis
Constant Temperature and Humidity Test Chamber
Reliability Test
Thermal Shock Chamber TSA-10A
Reliability Test
Appearance
Particle Size
Composition
Oxygen Content
Solderability
Laser Particle Size Analyser LS13320
Solder Particle Size Testing
aoying Oxygen Analyser RO-306
Oxygen Content Testing of Solder Powder
Keyence Scanning Electron Microscope SEM+EDX VE-7800
Observing the Surface Structure of Samples
DSC（DSC200F3）
Temperature testing related to internal thermal transformation of materials
Raw Material and Product QC
Flux Properties
Crystallinity
Properties
Shimadzu FIR IRprestige-21
IQC test of chemicals
Shimadzu XRF
EDX-720 RoHS and halogen test
Mettler Karl Fischer titrator V20/C30
Moisture content test
Viscosity & Thixotropy
Hazardous Substances
Chemical Composition
Performance
Reliability
Constant Temperature and Humidity Test Chamber
Reliability Test
Malcom Viscometer PCU-203
Thixotropy and Viscosity Testing of Solder
Shimadzu Spectrometer for RoHS EDX-720
RoHS Test
Malcom TK-1
solder paste tackiness test
Dionex ICS-1500 ion chromatography systems
solder halogen test
Patents
40 Patents in Total
12
Authorized Invention Patents
13
Utility Model Patents
1
PCT
9
Pending
High-Lights
01
Powder Manufacturing Technologies
01
/
Production method of low melting point spherical metal powder ZL201010517084
02
/
Micrometer/nanometer particle enhanced composite welding flux and preparation method thereof 201711280945.3
03
/
Medium temperature lead-free micrometallurgical solder, solder paste and preparation and welding method thereof 202410168321.6
04
/
Centrifugal atomization rotating disc, equipment and method
02
Solder Manufacturing Equipment
01
/
Vibrating screen classifier used for metal and non-metal powder ZL201020129884 8
02
/
Centrifugal liquid-phase forming device and method for manufacturing superfine tin-based alloy solder powder 202221725059.3
03
/
Ultrasonic dispersing device ZL201420325741.2
04
/
Make spherical fine metal powder's rotatory ultrasonic atomization device 201520502264.7
05
/
Centrifugal atomization rotating disc and equipment
03
Solder Technology
01
/
Tin base brazing solder for packaging inverted LED chip and preparation method thereof 201510438826.0
02
/
Tin-based paste braze solder and preparation method for same 201710486161.X
03
/
Preparation method of paste flux 201810677758.7
04
/
Solvent-free rosin-free flux for micro-bump welding, preparation and application method 202211662153.3
Fitech is a world-leading supplier of ultra-fine solder materials. You can contact us and learn more about our technologies.
R&D Team
Fitech R&D personnel account for 20% of the number of employees.
The R&D group includes a large proportion of young and middle-aged scientists, masters, bachelors, and other scientific researchers. The company has set up an engineering technology research center to carry out new technology and material research and product development.
Product Quality Control
The electronics industry of the Ministry of Industry and Information Technology: the leading unit for the formulation of the solder powder standard
Production Capability
01
/
Seven centrifugal atomized solder powder production lines (T3~T5:20-45μm).
02
/
Four ultra-fine solder powder production lines (T6~T10:1-15μm).
03
/
Four ultra-fine solder paste/adhesive production lines.
Quality Control
Completed Government Technology Development Projects
Development of the Key Technology of Low Melting Point Alloy Manufacture
Ministry: Municipal Development and Reform Commission
Date: 2016
Approval Number: Shen Fa Gai [2015] No. 1342
Project Impletement Time: Sep, 2015 - Sep, 2017
Acceptance Time: 9/3/2017 Acceptance P
Development of Ultra-Fine Lead-Free Solder Powder for Semiconductor Packaging
Ministry: Municipal Development and Reform Commission
Date: 2013
Approval Number: Shen Fa Gai [2013] No. 993
Project Impletement Time: Jan, 2013 - Dec, 2014
Acceptance Time: 4/1/2014 Acceptanc
Industry-University-Research Collaboration
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