The ultra-fine solder material produced by Fitech covers T6-T10 sizes, halogen-free, zero halogen-free, and halogen-free standards. The products can be used for printing, dispensing, jet printing, and other different processes. Fitech provides solder paste, epoxy solder paste, flux, and other products. The products provided for the customers engaged in Mini/Micro LED include LED packaging solder, fine-pitch solder, low-temperature fine-pitch solder, low-temperature high-reliability fine-pitch packaging solder, flip-chip packaging solder, camera module packaging solder, FPC packaging solder, and PCBA solder. Fitech has engaged in electronic and semiconductor packaging soldering materials for more than 20 years and sincerely customizes the most professional, suitable, and reliable solutions.