Military & Aerospace of solder paste-Shenzhen Fitech Co., Ltd.

Home > Application>Industry Applications>Military & Aerospace>Military & Aerospace

Military & Aerospace

Author: site Editor

Publish Time: 2024-07-22

Origin: site

Fitech provides high-reliability packaging materials and solutions for RF chips, power electronic chips, photoelectric chips, storage chips, and other components used in military and aerospace applications.

Related Applications

High-Reliability High-Temperature Solder (Au80Sn20)

>>Au80Sn20 Gold-Tin Solder Paste

Low alpha High-Lead Solder for High-Reliability Packaging

>>Low Alpha High-Lead Solder Paste/Solder Powder

MICRO-PHOTOELECTRIC (DISPLAY) PACKAGING

INTEGRATED CIRCUIT PACKAGING

MEMS PACKAGING

POWER DEVICE PACKAGING

Tags:

None

Our Professional Team is Here to Help

Our team is filled with seasoned experts who can’t wait to help you find the right solution for your business.

WE USE COOKIES.

We use cookies and other tracking technologies to improve your browsing experience on our website, to show you personalized content and targeted ads, to analyze our website traffic, and to understand where our visitors are coming from.