1. Product: Lead-free solder paste;

2. Flux: No-clean rosin resin, water-washable rosin resin, and water-based washing rosin resin;

3. Applications: Mini LED medium-temperature packaging and secondary reflow soldering with alloy melting temperatures of 217℃ to 219℃;

4. Type: T6(particle size: 5-15μm)-T9 (particle size: 1-5μm);

5. Advantages: Wide application, mature technology, various products available, high reliability, and small particle sizes;

6. Disadvantages: Higher reflow temperature than that of Sn63Pb37 eutectic solder;

7. Processes: Printing, dispensing, needle transfer, and jet printing;

8. Reflow under nitrogen protection (reflow oxygen content ≤100ppm).

Features

1. Excellent water cleaning performance to reach high soldering reliability;

2. Outstanding wettability;

3. Suitable for the packaging of micro-bump and ultra-fine-pitch component, providing extraordinary printing performance;

4. Extraordinary slump resistance;

5. Applicable to jet printing, pin transfer, dispensing, and printing with outstanding thixotropy and suitable viscosity;

6. Superior wettability and chemical activity;

7. Comply with RoHS and halogen-free environmental protection specifications.

Description
Fitech produces SAC305 solder powder with excellent sphericity, uniform particle size, and low oxygen content, and it is mixed with halogen-free flux to prepare FTP-305/FTD-305 series solder paste. The solder paste has a superior adhesion effect before soldering. Solvent volatilizes very slightly during soldering. Moreover, the solder paste has extraordinary wettability, anti-slump, and residue reduction properties. There is no solder ball formation during soldering. It is an ideal soldering material for micro-bump ultra-fine-pitch packaging.

Features 

1. FTP-305/FTD-305 has better thermal conductivity and electrical conductivity than that of silver conductive adhesive;

2. The ultra-fine solder powder has narrow size distribution. FTP-305/FTD-305 has stable solder paste printing and outstanding anti-slump performance, and it is suitable for ultra-fine-pitch packaging;

3. It has excellent chemical activity, solder ball elimination, and wettability;

4. High Compatibility:Equipment such as reflow ovens, electric hot plates, and stoves can be used;

5. It has excellent viscosity, outstanding stability, no delamination, and long stencil life.

Normally, the chips and the substrate have different thermal expansion coefficients. Therefore, the chips and substrate have different expansion amplitudes after die bond and reflow. For the pads with a size of dozens of microns, these differences in expansion have significant impacts on soldering. It is well known that thermal expansion increases with temperature. Hence, temperature increases will cause an expansion difference between the die-bond chip and the substrate. It is easy to cause misalignment of the pads in the reflow process because of high reflow temperature, leading to a series of reliability deficiencies such as open circuits and cold joint.

A fundamental solution to reliability deficiency due to thermal expansion coefficient differences is to use low-temperature solder materials which reduce peak reflow temperatures. SnBi/SnBiAg series solder is one of the most common low-temperature solders. The tipical melting point of SnBi/SnBiAg alloy is 139°C, which is nearly 80°C lower than that of SAC305.

Due to limitations of ultra-fine powder manufacturing technology, SAC305 is the main alloy used in ultra-fine die bond solders with the particle sizes of T7 and above. The low-temperature ultra-fine-pitch flip-chip die-bond solder paste developed by Fitech makes up for the blank of low-temperature ultra-fine lead-free solders. The low-temperature solder paste for die bond is made up of SnBiAg powder with the size of T7(2-11μm), T8(2-8μm), or T9(1-5μm) and a special flux, which effectively benefits the low-temperature soldering of ultra-fine-pitch die bond chip.

1. Product: Lead-free solder paste and lead-free epoxy solder adhesive;

2. Flux: No-clean, water-soluble , solvent-soluble; rosin resin, epoxy resin; 

3. Applications: Secondary reflow soldering with alloy melting temperatures of 139℃ and low-temperature packaging of Mini LED;

4. Type: T6-T9 (particle size:1-5μm);

5. Advantages: Reducing adverse impacts caused by thermal expansion difference and improving energy saving and environmental protection;

6. Disadvantages: Brittler solder joints than that of SAC products;

7. Processes: Printing, dispensing, needle transfer, and jet printing;

8. Reflow under nitrogen protection (reflow oxygen content ≤100ppm).

Description
Fitech’s tin-bismuth-silver alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with halogen-free flux to prepare FT-574 series low-temperature solder paste. Solvent volatilizes very slightly during soldering. There is no solder ball formation. Only a tiny amount of residue generates after soldering. Moreover, FT-574 has excellent wettability. The solder joints formed are plump and bright. The product is suitable for low-temperature component mounting.

Features 
1. Excellent wettability, solder ball elimination, and wettability;

2. Outstanding thixotropy and appropriate viscosity for the processes of jet printing, pin transfer, dispensing, printing, etc.;

3. Superior printing performance and stencil life because of stable viscosity and tack time over 12 hours;

4. Extraordinary soldering performance and proper wettability in different parts;

5. Environmental-friendly product using halogen-free formula.

Description
FSA-574 series epoxy solder paste employs a unique formulation featuring SnBi low-temperature solder powder renowned for its spherical shape, consistent particle size, and minimal oxygen content. Coupled with a halogen-free flux, this paste undergoes minimal solvent evaporation during soldering and curing, eliminating solder ball formation. The solder powder melts and contracts to create metallurgical solder joints, providing soldering performance equivalent to traditional solder pastes. Notably, FSA-574 requires no post-soldering cleaning as its residue transforms into a thermosetting adhesive, enhancing joint strength, corrosion resistance, and insulation. Ideal for delicate substrates and heat-sensitive components, FSA-574 ensures reliable packaging.

Features 

1. FSA-574 can achieve metallurgical connection and have better thermal conductivity and electrical conductivity than that of silver conductive paste;

2. It does not require washing after soldering, and the residue becomes thermosetting adhesive to promote electrical insulation;

3. It has excellent chemical activity and solder ball elimination performance;

4. The operation is simple. Equipment such as reflow ovens, electric hot plates, and stoves can be used;

5. It has advantages of excellent thixotropy, appropriate viscosity, outstanding stability, no delamination, and long stencil life;

6. It has the functions of self-assembly and chip correction. When applying epoxy solder paste, the chip is automatically corrected when heating, and the solder automatically combines with the pad.
   

1. Product: Lead-free solder paste and lead-free epoxy solder adhesive;

2. Flux: No-clean and water-soluble types of rosin resin and epoxy resin;

3. Applications: Low-temperature and high-reliability soldering

4. Type: T6(particle size:5-15μm)-T9 (particle size:1-5μm);

5. Advantages: Micro-nano-enhanced low-temperature solder with high mechanical strength, reduce the problem of poor soldering caused by inconsistent expansion coefficients;

6. Processes: Printing, dispensing, needle transfer, and jetting;

7. Reflow under nitrogen protection (reflow oxygen content ≤100ppm).

Description
FSA-170 series epoxy solder paste incorporates FL170 low-temperature alloy solder powder, characterized by exceptional sphericity, consistent particle size, and minimal oxygen content. Combined with a halogen-free flux, it exhibits minimal solvent evaporation during soldering and curing, preventing solder ball formation. The solder powder undergoes melting and contraction to create metallurgical solder joints, delivering soldering performance comparable to traditional solder pastes. This no-clean product transforms its residue into a thermosetting adhesive, enhancing joint strength, corrosion resistance, and insulation. Ideal for delicate substrates and heat-sensitive components, FSA-170 ensures reliable packaging.

Features

1.FSA-170 has excellent soldering strength with a peak reflow temperature of 170℃;

2. It is unnecessary to clean after soldering, and the residue becomes thermosetting adhesive to improve electric insulation and solder joint strength;

3. It has outstanding chemical activity and does not generate solder balls after soldering;

4. The operation is simple. Reflow oven, electric hot plate, and stove can be used;

5. It has advantages such as outstanding thixotropy, suitable viscosity, excellent stability, no delamination, and long operating life;

6. It has the functions of self-assembly and chip correction. When applying epoxy solder paste, the chip is automatically corrected when heating, and the solder automatically combines with the pad.

Description
FL170 is a low-temperature alloy solder powder with excellent sphericity, uniform particle size, low oxygen content, and high strength. It is combined with zero-halogen flux to produce FL-170 series low-temperature solder paste. Only a tiny amount of solvent volatilizes during the soldering process. There is no solder ball generation after soldering. The solder paste has outstanding residue minimization and wettability. The solder joints generated are solid, plump, and bright. FL-170 is ideal for low-temperature soldering, especially for low-temperature component mounting. 

Features 

1.Excellent soldering strength with a peak reflow temperature of 170℃;

2. Antimony-free, lead-free and environmental-friendly；

3. Outstanding thixotropy and appropriate viscosity available for jet printing, pin transfer, dispensing, printing, etc.;

4. Superior printing performance and stencil life because of stable viscosity and tack time over 12 hours;

5. Extraordinary soldering performance and proper wettability in different parts;

6. Less residue production after drying, no solder ball formation, and reliable solder joints.

Description
FSA-305 series epoxy solder paste is made of SAC305 solder powder with excellent sphericity, uniform particle size, and low oxygen content, and halogen-free flux. Only a tiny amount of solvent evaporates during soldering and curing. There is no solder ball generation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which have soldering effects equivalent to that of solder paste. Solder residue becomes thermoset adhesive and is attached around the solder joints to improve soldering strength, corrosion resistance, and insulation. FSA-305 is a no-clean product and is an excellent solder material for medium and high temperature soldering.

Features 

1. FSA-305 can achieve metallurgical connection and has better thermal conductivity and electrical conductivity than that of silver conductive paste;

2. It does not require washing after soldering, and the residue turns to thermosetting adhesive to promote electrical insulation;

3.  It has excellent chemical activity and solder ball elimination performance;

4. The operation is simple, and the equipment such as reflow ovens, electric hot plates, and stoves can be used;

5. It has advantages of excellent thixotropy, appropriate viscosity, outstanding stability, no delamination, and long stencil life;

6. It has the functions of self-assembly and chip correction. When applying epoxy solder paste, the chip is automatically corrected when heating, and the solder automatically combines with the pad.

The Fitech Anisotropic Conductive Adhesive (FACA) is made of low-temperature ultra-fine SnBiAg solder powder with excellent sphericity, uniform particle size, and low oxygen content and active flux. The conductive filler has uniform particle size and outstanding product dispersibility. Bonding of insulated material after hot-pressing curing increases soldering strength and reliability. No solvent volatilization occurs during hot-pressing curing. The temperature of hot pressing is low. The solder powder melts and metallurgically connects with the pad. In addition, anisotropic conductive paste has the properties of longitudinal conductive and non-conductive in the transverse direction. It is used for soldering between two fine-pitch conductive connection points in the manufacture of electronic components to avoid short circuits and improve yield. In addition, FACA is widely used in touch screens, smart card, radio frequency identification (RFID), flip chips, FPC, and other products. It is suitable for the assembly and packaging of ultra-fine pitch microelectronic circuits and has contributed to the miniaturization of microelectronic packaging.

Features 

1.FACA-138 is longitudinal conductive and non-conductive in the transverse direction;

2. Hot-pressing curing improves bonding strength and electrical conductivity;

3. It is reliable for high precision soldering and rapid curing of low-temperature soldering;

4. The conductive particles have excellent sphericity, uniform particle size, and outstanding product dispersibility;5. It has extraordinary thixotropy, viscosity, and stability.

Description
FEF-180/240 is a type of no-clean zero-halogen epoxy soldering paste that does not contain rosin. It does not splash during soldering. The solder residue becomes thermoset adhesive and is attached around the solder joints to improve soldering strength, corrosion resistance, and insulation. FEF-180/240 has the functions of self-assembly and self-correction, which is an ideal solder for high-precision and high-reliability microelectronic packaging.

Features

1.FET-180/240 can achieve metallurgical connection and have better thermal conductivity and electrical conductivity than that of silver conductive paste;

2. It does not require washing after soldering, and the residue is thermosetting into adhesive to promote electrical insulation and solder joint reliability;

3. It has excellent chemical activity and solder ball elimination performance;

4. Thermoset adhesive is attached around the solder joints to enhance reliability;

5. The operation is simple. Reflow ovens, electric hot plates, and stoves can be used;

6. It has excellent thixotropy, suitable viscosity, outstanding stability, long operating life, and no delamination.

The developing flip-chip technology demands the assembly of increasingly dense LED chips on panels. Mass transfer remains a critical challenge in fine-pitch microLED display manufacturing. Selecting the right lead-free solder paste is paramount, with size and time being key factors. As chip and pad dimensions shrink, solder paste characteristics must be correspondingly reduced. Moreover, unlike traditional SMT processes, lead-free solder paste for flip-chip often faces extended indoor storage before reflow, necessitating robust "pause-response" behavior. Fitech's lead-free solder paste for ultra-fine-pitch die bonding excels in maintaining performance under these demanding conditions. Rigorous simulation of the die bonding process guides the development and production of our solder products, ensuring adherence to the highest industry standards.

Description
FSA-170 series epoxy solder paste is made of low-temperature alloy solder powder FL170 with excellent sphericity, uniform particle size, low oxygen content, and halogen-free flux. The solvent evaporates very slightly during soldering and curing. There is no solder ball generation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which are equivalent to the soldering effects of solder paste. FSA-170 is a no-clean product. Solder residue becomes thermosetting adhesive around the solder joints to improve soldering strength, corrosion resistance, and insulation. FSA-170 is suitable for the reliable packaging of thin substrates and Thermosensitive components.

Features

1. FSA-170 has excellent soldering strength with a peak reflow temperature of 170℃;

2. It is unnecessary to clean after soldering, and the residue becomes thermosetting adhesive to improve electric insulation and solder joint strength;

3. It has outstanding chemical activity and does not generate solder balls after soldering;

4. The operation is simple. Reflow oven, electric hot plate, and stove can be used;

5. It has advantages such as outstanding thixotropy, suitable viscosity, excellent stability, no delamination, and long operating life;

6. It has the functions of self-assembly and chip correction. When applying epoxy solder paste, the chip is automatically corrected when heating, and the solder automatically combines with the pad.

Description
FSA-574 series epoxy solder paste is formulated with SnBi series low-temperature ultra-fine solder powder with excellent sphericity, uniform particle size, and low oxygen content, and halogen-free flux. Only a tiny amount of solvent evaporates during the soldering and curing. There is no solder ball generation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which have soldering effects equivalent to that of solder paste. FSA-574 epoxy solder paste is unnecessary to clean after soldering. The solder residue becomes thermoset adhesive, which is attached around the solder joint to improve soldering strength, corrosion resistance, and insulation. FSA-574 is suitable for the reliable packaging of thin substrates and non-heat-resistance components.

Features 

1. FSA-574 can achieve metallurgical connection and have better thermal conductivity and electrical conductivity than that of silver conductive paste;

2. It does not require washing after soldering, and the residue becomes thermosetting adhesive to promote electrical insulation;

3. It has excellent chemical activity and solder ball elimination performance;

4. The operation is simple. Equipment such as reflow ovens, electric hot plates, and stoves can be used;

5. It has advantages of excellent thixotropy, appropriate viscosity, outstanding stability, no delamination, and long stencil life;

6. It has the functions of self-assembly and chip correction. When applying epoxy solder paste, the chip is automatically corrected when heating, and the solder automatically combines with the pad.