The alloy composition of eutectic gold-tin solder paste for MEMS packaging consists of 80%wt of gold and 20%wt of tin (Au80Sn20). Under the impact of the excellent characteristics of the FH-280 product and Fitech’s advanced powder manufacturing technology, Fitech’s gold-tin solder paste has many advantages such as high tensile strength, excellent corrosion resistance, superior thermal creeping performance, and premium compatibility with other precious metals. It also has extraordinary electrical conductivity and thermal conductivity. The MEMS packaging gold-tin solder paste (T3-T6) has a melting point of 280℃, supporting the printing and dispensing process.

Description
FH-280 series is eutectic gold-tin solder paste with a melting point of 280℃. It is suitable for high-reliability packaging of semiconductors and microelectronic devices and high thermal-conductive packaging of high-power devices. The melting point of gold-tin solder paste is high. Therefore, FH-280 can be used to avoid melting and failure of solder joints in secondary reflow. It has been used in military, aerospace, medical, and other fields. FH-280 gold-tin solder paste has excellent thixotropy, suitable viscosity, outstanding wettability, and brilliant soldering performance. In addition, it has a high melting point, high tensile strength, excellent oxidation and corrosion resistance, extraordinary thermal conductivity, and superior electrical conductivity. It complies with RoHS standards. It exhibits stable performance under high-temperature operation.

Features 

1. FH-280 is a type of solder paste with a high melting point and high tensile strength;

2. It has superior anti-oxidation and anti-corrosion performance, and it is compatible with other precious metals; 

3. It has outstanding thixotropy, suitable viscosity, excellent wettability, high tensile strength and extraordinary soldering performance; 

4. It has excellent thermal conductivity and electrical conductivity;

5. It is the priority choice in reflow soldering because of its high melting point;6. It complies with RoHS standards.

Description
SnSb10 alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with no-clean flux to produce FTP-901/FTD-901 series solder paste based on metallurgical method and chemical structure. It has an outstanding adhesion effect before soldering. Solvent volatilizes very slightly during soldering. Moreover, the solder paste has extraordinary wettability, anti-slump, and residue reduction properties. It is developed to meet the market demand for heat-resistant microelectronic device assembly and precision soldering. FTP-901/FTD-901 has a superior heat resistance and heat dissipation performance. It also improves the soldering voiding and the strength and conductivity of intermetallic compounds. 

Features

1. FT-901 has extraordinary thermal conductivity, electrical conductivity, and soldering strength;

2. Special ultra-fine solder powder satisfies high-power chip soldering with a size exceeding 20mil;

3. The operation is simple. Reflow oven, electric hot plate, and stove can be used;

4. It has advantages such as outstanding thixotropy, appropriate viscosity, excellent stability, no delamination, and long operating life;

5. The creep resistance of FT-901 is extraordinary, and it has heat resistance better than that of SAC305 alloy.

Description
FL170 is a low-temperature alloy solder powder with excellent sphericity, uniform particle size, low oxygen content, and high strength. It is combined with halogen-free flux to produce FL-170 series low-temperature solder paste. Only a tiny amount of solvent volatilizes during the soldering process. There is no solder ball generation after soldering. The solder paste has outstanding residue minimization and wettability. The solder joints generated are solid, plump, and bright. FL-170 is ideal for low-temperature soldering, especially for low-temperature component mounting. 

Features 

1. Excellent soldering strength with a peak reflow temperature of 170℃;

2. Antimony-free, lead-free and environmental-friendly；

3. Outstanding thixotropy and appropriate viscosity available for jet printing, pin transfer, dispensing, printing, etc.;

4. Superior printing performance and stencil life because of stable viscosity and tack time over 12 hours;

5. Extraordinary soldering performance and proper wettability in different parts;

6. Less residue production after drying, no solder ball formation, and reliable solder joints.

Description
FH260 solder powder with excellent sphericity, uniform particle size, and low oxygen content is combined with halogen-free flux to produce FH-260 series solder paste. It is a high-temperature lead-free product developed for secondary reflow soldering of power semiconductor and microelectronic packaging. The alloy is synthesized based on bismuth elements by adding reinforced micro/nanoparticles, successfully replacing high-lead solder paste, and meeting RoHS environmental protection standards. FH-260P series and FH-260D series are adapted to printing and dispensing processes, respectively.

Features 

1. FH260 is a lead-free antimony-free product exempt from RoHS;

2. It has excellent thixotropy, viscosity, wettability, and solderability;

3. It is achievable for high-density integrated circuit packaging and secondary reflow soldering of circuit boards;

4. The use of ultra-fine powder improves ultra-fine-pitch and micro-assembly printing performance;

5. It is a no-clean halogen-free product that only produces a tiny amount of residue.

Description
Fitech produces SAC305 solder powder with excellent sphericity, uniform particle size, and low oxygen content, and it is mixed with halogen-free flux to prepare FTP-305/FTD-305 series solder paste. The solder paste has a superior adhesion effect before soldering. Solvent volatilizes very slightly during soldering. Moreover, the solder paste has extraordinary wettability, anti-slump, and residue reduction properties. There is no solder ball formation during soldering. It is an ideal soldering material for micro-bump ultra-fine-pitch packaging.

Features 

1. FTP-305/FTD-305 has better thermal conductivity and electrical conductivity than that of silver conductive adhesive;

2. The ultra-fine solder powder has narrow size distribution. FTP-305/FTD-305 has stable solder paste printing and outstanding anti-slump performance, and it is suitable for ultra-fine-pitch packaging;

3. It has excellent chemical activity, solder ball elimination, and wettability;

4. The operation is simple. Equipment such as reflow ovens, electric hot plates, and stoves can be used;

5. It has excellent viscosity, outstanding stability, no delamination, and long stencil life.

Description
FL170 is a low-temperature alloy solder powder with excellent sphericity, uniform particle size, low oxygen content, and high strength. It is combined with halogen-free flux to produce FL-170 series low-temperature solder paste. Only a tiny amount of solvent volatilizes during the soldering process. There is no solder ball generation after soldering. The solder paste has outstanding residue minimization and wettability. The solder joints generated are solid, plump, and bright. FL-170 is ideal for low-temperature soldering, especially for low-temperature component mounting. 

Features 

1. Excellent soldering strength with a peak reflow temperature of 170℃;

2. Antimony-free, lead-free and environmental-friendly；

3. Outstanding thixotropy and appropriate viscosity available for jet printing, pin transfer, dispensing, printing, etc.;

4. Superior printing performance and stencil life because of stable viscosity and tack time over 12 hours;

5. Extraordinary soldering performance and proper wettability in different parts;

6. Less residue production after drying, no solder ball formation, and reliable solder joints.

Description
FSA-170 series epoxy solder paste is made of low-temperature alloy solder powder FL170 with excellent sphericity, uniform particle size, low oxygen content, and halogen-free flux. The solvent evaporates very slightly during soldering and curing. There is no solder ball generation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which are equivalent to the soldering effects of solder paste. FSA-170 is a no-clean product. Solder residue becomes thermosetting adhesive around the solder joints to improve soldering strength, corrosion resistance, and insulation. FSA-170 is suitable for the reliable packaging of thin substrates and non-heat-resistance components.

Features

1. FSA-170 has excellent soldering strength with a peak reflow temperature of 170℃;

2. It is unnecessary to clean after soldering, and the residue becomes thermosetting adhesive to improve electric insulation and solder joint strength;

3. It has outstanding chemical activity and does not generate solder balls after soldering;

4. The operation is simple. Reflow oven, electric hot plate, and stove can be used;

5. It has advantages such as outstanding thixotropy, suitable viscosity, excellent stability, no delamination, and long operating life;

6. It has the functions of self-assembly and chip correction. When applying epoxy solder paste, the chip is automatically corrected when heating, and the solder automatically combines with the pad.

Laser solder paste used for laser soldering is suitable for camera modules, FPC flexible circuit boards, thermal devices, MEMS, and other scenarios that must be locally heated and soldered. Laser soldering is a local soldering process with rapid heating and cooling, which requires laser solder paste to avoid solder detonation, splashing, and solder ball generation. Solder joints should have excellent wettability during extreme soldering time. The laser solder paste products developed by Fitech meet the requirements of rapid soldering. Meanwhile, it can eliminate solder detonation, solder splashing, and solder ball formation to ensure soldering reliability. Laser solder paste adopts ROSH-compliant halogen-free formulation.

Description
FWS-305L series solder paste is formulated with SAC305 solder powder and excellent halogen-free water-soluble flux. FWS-305L has outstanding adhesion performance before soldering. It is designed for the laser soldering process and has many advantages, such as superior soldering effect, no spatters, and excellent water solubility. FWS-305L is ideal for high-reliability micro-bump ultra-fine-pitch packaging.

Features

1. FWS-305L is suitable for rapid laser soldering and can eliminate spatter during soldering;

2. It has outstanding thixotropy and appropriate viscosity and can be used for jet printing, pin transfer, dispensing, printing, etc.;

3. It has excellent chemical activity and wettability;

4. It has outstanding water solubility;5. It complies with RoHS and halogen-free environmental protection specifications.

1. Very effective for camera module packaging;

2. Provision of reliable packaging materials and solutions;

3. No-clean epoxy solder paste with high soldering strength;

4. Excellent protection of modules because of low-temperature soldering;

5. Use in the processes of printing, dispensing, and needle transfer;

6. Reflow under nitrogen protection (reflow oxygen content ≤100ppm).

Description
FSA-170 series epoxy solder paste is made of low-temperature alloy solder powder FL170 with excellent sphericity, uniform particle size, low oxygen content, and halogen-free flux. The solvent evaporates very slightly during soldering and curing. There is no solder ball generation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which are equivalent to the soldering effects of solder paste. FSA-170 is a no-clean product. Solder residue becomes thermosetting adhesive around the solder joints to improve soldering strength, corrosion resistance, and insulation. FSA-170 is suitable for the reliable packaging of thin substrates and non-heat-resistance components.

Features

1. FSA-170 has excellent soldering strength with a peak reflow temperature of 170℃;

2. It is unnecessary to clean after soldering, and the residue becomes thermosetting adhesive to improve electric insulation and solder joint strength;

3. It has outstanding chemical activity and does not generate solder balls after soldering;

4. The operation is simple. Reflow oven, electric hot plate, and stove can be used;

5. It has advantages such as outstanding thixotropy, suitable viscosity, excellent stability, no delamination, and long operating life;

6. It has the functions of self-assembly and chip correction. When applying epoxy solder paste, the chip is automatically corrected when heating, and the solder automatically combines with the pad.

Description
FSA-574 series epoxy solder paste is formulated with SnBi series low-temperature ultra-fine solder powder with excellent sphericity, uniform particle size, and low oxygen content, and halogen-free flux. Only a tiny amount of solvent evaporates during the soldering and curing. There is no solder ball generation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which have soldering effects equivalent to that of solder paste. FSA-574 epoxy solder paste is unnecessary to clean after soldering. The solder residue becomes thermoset adhesive, which is attached around the solder joint to improve soldering strength, corrosion resistance, and insulation. FSA-574 is suitable for the reliable packaging of thin substrates and non-heat-resistance components.

Features 

1. FSA-574 can achieve metallurgical connection and have better thermal conductivity and electrical conductivity than that of silver conductive paste;

2. It does not require washing after soldering, and the residue becomes thermosetting adhesive to promote electrical insulation;

3. It has excellent chemical activity and solder ball elimination performance;

4. The operation is simple. Equipment such as reflow ovens, electric hot plates, and stoves can be used;

5. It has advantages of excellent thixotropy, appropriate viscosity, outstanding stability, no delamination, and long stencil life;

6. It has the functions of self-assembly and chip correction. When applying epoxy solder paste, the chip is automatically corrected when heating, and the solder automatically combines with the pad.