The low alpha solder series is a high lead solder developed by Fitech with a low alpha particle count for SiP, Flip Chip, and other high-density and miniaturized packages. Low alpha solder is applied in mobile communications (smartphones, tablets & wearables), IoT (Wi-Fi, BLTE, UWB, LTE-M & NB-IoT, consumption & industry), automotive electronics (infotainment systems), high-performance computing (computing, networking & artificial intelligence) and other fields. Small amounts of alpha particles emitted by packaging materials can cause soft errors and adversely impact miniaturized high-reliability devices, which require packaging materials to have low alpha particle counts. Fitech provides low alpha product (<0.01 cph/cm²) and ultra-low alpha product (<0.002cph/cm2). The low alpha products covering T3 to T6 are lead-free or high-lead, having the advantages of excellent powder sphericity, narrow particle size distribution, low oxygen content, and high chemical purity. It meets the alpha particle emission specifications. Fitech can provide customized development services for customers.