Low-alpha high-lead solder series is developed by Fitech based on customer requirements. Tiny amounts of alpha particles emitted by packaging materials can cause soft errors and adversely impact miniaturized high-reliability devices. As a result, packaging materials must have a low alpha particle count. Fitech's T3 to T6 low-alpha products include Sn5Pb92.5Ag2.5, Sn5Pb95, and other alloys. Fitech’s low-alpha high-lead solder products have the advantages of outstanding solder powder sphericity, narrow particle size distribution, low oxygen content, and high chemical purity. The alpha particle emission strictly follows the specifications. Fitech is willing to provide customized development services if it is necessary.

Features

1. RoHS-exempt and high-reliability products;

2. Low alpha particle count meeting the particle emission specifications;

3. T3 to T6 solder products ensuring outstanding printing performance with different pitches;

4. Excellent sphericity, Uniform particle size distribution, and low oxygen content;

5. Solder coating to provide superior anti-oxidation performance and extraordinary solder stability.

The lead-free silver-free solder series developed by Fitech handles the electromigration of conventional SAC solder due to the existence of silver. According to the different requirements of customers, Fitech provides T6-T9 solder products with alloy components such as SnCuX, SN100C, etc. In addition, the products include ultra-fine solder powder, no-clean solder paste, water-soluble solder paste, epoxy solder paste, etc. The lead-free silver-free solder series has many advantages, such as excellent powder sphericity, narrow particle size distribution, lead-free silver-free alloys, no silver migration, bright solder joints, and outstanding wettability.

Features 
1. Lead-free silver-free formula is used to avoid silver migration;

2. T6 to T9 ultra-fine solder powders provide superior ultra-fine-pitch printing performance.;

3. The alloy solder joints are bright, and the reliability of the SN100C solder joint is comparable to that of SAC305;

4. FT-007 has excellent wettability and solderability;

5. FT-007 is an environmental-friendly halogen-free product. No-clean and water-soluble solders are available;

6. Solder coating is applied to achieve extraordinary anti-oxidation performance and outstanding solder stability.

Fitech’s water-soluble solder paste is formulated with SAC305 solder powder and excellent halogen-free flux. The water-soluble solder paste has outstanding adhesion performance before soldering. In addition, it has many advantages, such as stable viscosity, long operating time, extraordinary soldering effect, and excellent water washing performance, which makes it ideal for high-reliability micro-bump fine-pitch packaging.

Features
1. Excellent water cleaning performance to reach high soldering reliability;

2. Outstanding wettability;

3. Suitable for the packaging of micro-bump and ultra-fine-pitch component, providing extraordinary printing performance;

4. Extraordinary slump resistance;

5. Applicable to jet printing, pin transfer, dispensing, and printing with outstanding thixotropy and suitable viscosity;

6. Superior wettability and chemical activity;7. Comply with RoHS and halogen-free environmental protection specifications.

The low alpha lead-free solder is a lead-free solder with a low alpha particle count developed by Fitech. Low alpha solder can effectively reduce system soft errors, which makes it suitable for high-density SiP, flip-chip, and other packaging processes requiring high system reliability.

Description
FEF-180/240 is a type of no-clean halogen-free epoxy soldering paste that does not contain rosin. It does not splash during soldering. The solder residue becomes thermoset adhesive and is attached around the solder joints to improve soldering strength, corrosion resistance, and insulation. FEF-180/240 has the functions of self-assembly and self-correction, which is an ideal solder for high-precision and high-reliability microelectronic packaging.

Features

1. FET-180/240 can achieve metallurgical connection and have better thermal conductivity and electrical conductivity than that of silver conductive paste;

2. It does not require washing after soldering, and the residue is thermosetting into adhesive to promote electrical insulation and solder joint reliability;

3. It has excellent chemical activity and solder ball elimination performance;

4. Thermoset adhesive is attached around the solder joints to enhance reliability;

5. The operation is simple. Reflow ovens, electric hot plates, and stoves can be used;

6. It has excellent thixotropy, suitable viscosity, outstanding stability, long operating life, and no delamination.

Description
Fitech produces SAC305 solder powder with excellent sphericity, uniform particle size, and low oxygen content, and it is mixed with halogen-free flux to prepare FTP-305/FTD-305 series solder paste. The solder paste has a superior adhesion effect before soldering. Solvent volatilizes very slightly during soldering. Moreover, the solder paste has extraordinary wettability, anti-slump, and residue reduction properties. There is no solder ball formation during soldering. It is an ideal soldering material for micro-bump ultra-fine-pitch packaging.

Features 

1. FTP-305/FTD-305 has better thermal conductivity and electrical conductivity than that of silver conductive adhesive;

2. The ultra-fine solder powder has narrow size distribution. FTP-305/FTD-305 has stable solder paste printing and outstanding anti-slump performance, and it is suitable for ultra-fine-pitch packaging;

3. It has excellent chemical activity, solder ball elimination, and wettability;

4. The operation is simple. Equipment such as reflow ovens, electric hot plates, and stoves can be used;

5. It has excellent viscosity, outstanding stability, no delamination, and long stencil life.

Description
FL170 is a low-temperature alloy solder powder with excellent sphericity, uniform particle size, low oxygen content, and high strength. It is combined with halogen-free flux to produce FL-170 series low-temperature solder paste. Only a tiny amount of solvent volatilizes during the soldering process. There is no solder ball generation after soldering. The solder paste has outstanding residue minimization and wettability. The solder joints generated are solid, plump, and bright. FL-170 is ideal for low-temperature soldering, especially for low-temperature component mounting. 

Features

1. Excellent soldering strength with a peak reflow temperature of 170℃;

2. Antimony-free, lead-free and environmental-friendly；

3. Outstanding thixotropy and appropriate viscosity available for jet printing, pin transfer, dispensing, printing, etc.;

4. Superior printing performance and stencil life because of stable viscosity and tack time over 12 hours;

5. Extraordinary soldering performance and proper wettability in different parts;6. Less residue production after drying, no solder ball formation, and reliable solder joints.

Description
Fitech’s tin-bismuth-silver alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with halogen-free flux to prepare FT-574 series low-temperature solder paste. Solvent volatilizes very slightly during soldering. There is no solder ball formation. Only a tiny amount of residue generates after soldering. Moreover, FT-574 has excellent wettability. The solder joints formed are plump and bright. The product is suitable for low-temperature component mounting.

Features 

1. Excellent wettability, solder ball elimination, and wettability;

2. Outstanding thixotropy and appropriate viscosity for the processes of jet printing, pin transfer, dispensing, printing, etc.;

3. Superior printing performance and stencil life because of stable viscosity and tack time over 12 hours;

4. Extraordinary soldering performance and proper wettability in different parts;

5. Environmental-friendly product using halogen-free formula.

Description
FSA-170 series epoxy solder paste is made of low-temperature alloy solder powder FL170 with excellent sphericity, uniform particle size, low oxygen content, and halogen-free flux. The solvent evaporates very slightly during soldering and curing. There is no solder ball generation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which are equivalent to the soldering effects of solder paste. FSA-170 is a no-clean product. Solder residue becomes thermosetting adhesive around the solder joints to improve soldering strength, corrosion resistance, and insulation. FSA-170 is suitable for the reliable packaging of thin substrates and non-heat-resistance components.

Features

1. FSA-170 has excellent soldering strength with a peak reflow temperature of 170℃;

2. It is unnecessary to clean after soldering, and the residue becomes thermosetting adhesive to improve electric insulation and solder joint strength;

3. It has outstanding chemical activity and does not generate solder balls after soldering;

4. The operation is simple. Reflow oven, electric hot plate, and stove can be used;

5. It has advantages such as outstanding thixotropy, suitable viscosity, excellent stability, no delamination, and long operating life;

6. It has the functions of self-assembly and chip correction. When applying epoxy solder paste, the chip is automatically corrected when heating, and the solder automatically combines with the pad.

Description
FSA-305 series epoxy solder paste is made of SAC305 solder powder with excellent sphericity, uniform particle size, and low oxygen content, and halogen-free flux. Only a tiny amount of solvent evaporates during soldering and curing. There is no solder ball generation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which have soldering effects equivalent to that of solder paste. Solder residue becomes thermoset adhesive and is attached around the solder joints to improve soldering strength, corrosion resistance, and insulation. FSA-305 is a no-clean product and is an excellent solder material for medium and high temperature soldering.

Features 

1.FSA-305 can achieve metallurgical connection and has better thermal conductivity and electrical conductivity than that of silver conductive paste;

2.It does not require washing after soldering, and the residue turns to thermosetting adhesive to promote electrical insulation;

3. It has excellent chemical activity and solder ball elimination performance;

4.The operation is simple, and the equipment such as reflow ovens, electric hot plates, and stoves can be used;

5.It has advantages of excellent thixotropy, appropriate viscosity, outstanding stability, no delamination, and long stencil life;

6.It has the functions of self-assembly and chip correction. When applying epoxy solder paste, the chip is automatically corrected when heating, and the solder automatically combines with the pad.

A microcontroller unit (MCU) is one of the core components of modern electronic information intelligent control, also known as a single-chip microcomputer or single-chip microcomputer. It is a microcomputer that integrates main components such as a central processing unit (CPU), memory, timer/counter, various analog signal acquisition modules, and communication interfaces on a chip. The function of MCU is signal processing and control. It is widely used in household appliances, consumer electronics, medical equipment, computers, industrial control, automotive electronics, etc.