What are the advantages of ultrafine tin powder?

Ultrafine tin powder is ultrafine solder powder with particle size model above T6 (5~15μm), including T6 (5~15μm), T7 (2~11μm), T8 (2~8μm), T9 (1~5μm), T10 (1~3μm) and other models of ultrafine tin powder. Ultra micro tin powder is the key material for microelectronics and semiconductor packaging, precision device packaging.

The advantages of ultrafine tin powder are mainly reflected in the following aspects:

Fine particle size and uniform in distribution:

① The average particle size of ultra-fine tin powder is usually between a few microns and ten microns, which has a smaller particle size compared with traditional solder powder.

② Due to the use of advanced ultra-micro-grinding technology, the particle size distribution of ultra-micro tin powder is even, making its physical and chemical properties more stable.

Large specific surface area:

The reduced particle size of ultra-fine tin powder directly leads to a significant increase in its specific surface area. A larger specific surface area means that the tin powder has more surface oxide film, which requires higher soldering activity to achieve good soldering.

Good sphericity:

The small size and large surface area of ultramicro solder powders means that a low oxygen content can only be achieved if the powder is spherical. The morphology of the powder determines the stability of the subsequent use of the process, only a good degree of sphericity to achieve precision printing process, precision dispensing spray printing process of continuous stability, more friendly to the process equipment.

Small particle size and good uniformity:

Ultra-micro tin powder due to its small particle size, can be more amount of solder paste as well as a smaller volume to achieve the transfer of solder paste, to achieve different sizes of solder joints, to meet the needs of different solder joints large. This feature makes the ultra-micro tin powder has a wide range of application prospects in the field of fine printing solder paste, dispensing solder paste, spray printing solder paste, anisotropic conductive adhesive and so on.

Improvement of electrical and thermal conductivity:

Due to the smaller particle size and larger specific surface area of the ultra-micro tin powder, its application in electronic packaging, soldering and other fields can significantly improve the electrical and thermal conductivity. This helps to reduce electrical and thermal resistance and improve the performance and reliability of electronic products.

Easy to process and apply:

Ultra-micro tin powder has good fluidity and dispersibility, and can be more evenly dispersed in the base material, thus improving processing performance and product quality. Whether in the process of dot coating, spray printing, or in the preparation and printing of electronic pastes, ultra-micro tin powder can bring better processing and application results.

Environmental protection and energy saving:

During the preparation of ultrafine tin powder, due to the use of advanced crushing technology and equipment, the harvest rate of ultrafine tin powder is greatly improved, and low energy consumption and low emission production can be achieved. In addition, the application of ultra-fine tin powder also helps to reduce material waste and environmental pollution, in line with the development trend of environmental protection and energy saving.

Good stability:

Although tin powder is stable in air, ultra-micro tin powder has better oxidation resistance and stability due to its special preparation process and surface treatment, Coating process for powder. This makes the ultramicro tin powder can keep a longer effective period and stable performance during storage and use.

In summary, the ultrafine tin powder has the advantages of fine particle size, large specific surface area, good uniformity and sphericity, improved electrical and thermal conductivity, easy processing and application, environmental protection and energy saving, and good stability. These advantages make the ultra-fine tin powder in electronics, chemical industry, materials and other fields with a wide range of application prospects.

Next, I would like to recommend Fitech, Fitech company is currently the world's only one capable of producing T2-T10 all size models of ultra-micro alloy solder powder packaging materials suppliers. Ultra-micro solder paste above T6 produced by using liquid phase forming technology has shown excellent printability, release transferability, shape and stability retention in practical applications. At the same time, it has stable viscosity and thixotropy coefficient, and no tin bead or bridging defects after long time printing. If you have any questions or needs about Fitech Ultra Micro Tin Powder or other products, we very much welcome you to contact us at any time, and look forward to communicating and negotiating with you.