Reflow Solder Bead Causes and Solutions_Shenzhen Fitech

Solder bead is one of the common defects of reflow soldering, the cause is multi-faceted, not only affects the appearance of the solder joints and will cause bridging. Tin beads can be divided into two categories, one appears on the side of the chip components, often a large independent ball; the other appears in the IC pins around, scattered small

PCB Inspection Technology and Application_ Automatic Optical Inspection_Shenzhen Fitech

Automatic Optical Inspection (AOI) is a high-end product that integrates multi-disciplinary technologies such as optics, computer graphics recognition and automatic control, the core of which lies in the function of its analysis software.