Is leaded or lead-free solder paste better?

The choice of solder paste, the comparison between leaded and lead-free solder paste, depends on a number of factors such as specific application scenarios, environmental requirements, cost considerations and soldering results. The following is a detailed analysis of the advantages and disadvantages of the two and the process and so on

How to set the conditions for acceptable solder paste printing graphics?

Fine-pitch components (e.g. QFN, BGA, etc.) have extremely high requirements for solder paste uniformity, thickness and edge definition due to their small pin spacing. Any minor printing defects can lead to poor soldering, such as bridging, open circuits or empty soldering. Therefore, these special requirements must be fully taken into account when

Under-tin and under-printing in the SMT process

The phenomena of less tin and missed prints in the SMT (Surface Mount Technology) process are common quality problems, and they have an important impact on the quality and reliability of products. The following is a detailed analysis of these two phenomena

Furnace Temperature Profile Design and Solutions

Furnace temperature profile design is a complex and critical process, which directly affects product quality and production efficiency. In the design of the temperature curve, the following aspects need to be noted:

Analysis of the advantages and disadvantages of OSP and application issues

OSP (Organic Solder Protective Sheet) as a surface treatment technology has shown significant advantages in electronics manufacturing, especially in fine pitch devices and applications with high coplanarity requirements, but also comes with some challenges and considerations. The following is a detailed analysis of OSP applications, advantages, sho

What are the factors that affect the reliability of lead-free solder joints?

Lead-free soldering does present some solder joint reliability challenges relative to traditional lead (Pb) containing processes. This stems mainly from the differences between Pb-free brazing materials and traditional brazing materials, as well as the adjustment of process parameters. So what are the specific factors that affect the reliability of

Formation of Solder Joints during BGA Reflow Soldering

The formation of solder joints during BGA (Ball Grid Array) reflow soldering is a complex and delicate process that involves a number of phases, including preheating, solder melting, ball collapsing, auto-alignment, and so on. The following is a detailed analysis of the process:

Lead-free brazing alloy properties summary

What is lead-free solder? Lead-free solder (Pb-free solder) means that the chemical composition of the solder does not contain lead (Pb), and the Rohs Directive requires that the Pb content does not exceed 1000 PPM, or 0.1%. The main representative of Pb-free solder is tin-based solder, and the most used Pb-free solder is tin-silver-copper Pb-free