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How is solder paste made?

Publish Time: 2024-09-02

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How is solder paste made?

 

The main materials that need to be prepared to make solder paste include tin powder and flux. Among them, tin powder is the main ingredient and flux is the auxiliary ingredient, and they can improve the soldering quality and workmanship.

How is solder paste made?cid=64

 

The process of making solder paste mainly includes the following steps:

1, material preparation, tin powder, flux quality control, operating environment control: solder paste production requires solder powder and matching flux ready, flux one night in advance to return to room temperature, the quality meets the requirements. Temperature and humidity to meet the requirements of the control of solder paste production.

2, flux mixing: pour the required weight of flux into the stirring pot at a certain speed and stir evenly. The ratio of solder powder and flux needs to be adjusted according to the specific process requirements and product performance, the general content of tin powder in about 90%.

3, add tin powder mixing: tin powder before joining through the hand sieve, can be dispersed tin powder, while safeguarding the tin powder without large particles of foreign matter, you can add 1/2 tin powder, stirring for a period of time and then add the other half of the tin powder, adding tin powder in two times.

4、Fine processing: after stirring for a period of time, open the stirring pot, clean up the stirring paddle and the side wall of the uneven solder paste to the bottom.

5、Defoaming mixing: After mixing evenly under normal pressure, then carry out vacuum mixing for 10-20 minutes to remove the air bubbles inside the solder paste.

6、Process Inspection: Take the stirred solder paste and send it to process inspection. Check the fluidity and viscosity of the paste, if necessary to adjust, you can add the appropriate amount of additives or tin powder. This step is to ensure that the paste meets the specific process requirements.

7, defoaming and packaging: process inspection process of the solder paste into the next process, defoaming and packaging, printing type solder paste is directly packaged in the solder paste cans. Syringe type solder paste also need to carry out the second defoaming process.

8,  finished product inspection: the mixing of good solder paste for performance testing, mainly including solder life test, viscosity adhesion test, viscosity stability test, electrical performance test, etc., to ensure product quality and stability.

8、Labelled into the warehouse: The made solder paste will be divided into packages and stored in sealed containers to prevent moisture and dust and other contamination. At the same time, it is necessary to put a label on the container to indicate the production date of the solder paste, production batch and other information.

There are also some important control factors that need to be taken care of during the production of solder paste. For example, stirring time, stirring speed and stirring method will affect the quality and performance of the solder paste. Stirring time is generally between 30 minutes and 4 hours, and stirring speed is about 10-30 rpm. if the stirring time is too long or the speed is too fast, it may affect the quality and performance of the solder paste.

Next, I recommend Fitech solder paste. Fitech solder paste has various models and specifications, which can meet the needs of different scenarios. For example, ultra-micro solder paste, gold solder paste, multiple reflow solder paste and water-soluble solder paste. Among them, ultra-micro solder paste is suitable for thin substrates, non-heat-resistant devices, high-reliability device packaging applications; gold solder paste is one of the most reliable microelectronics and semiconductor soldering materials on the market, suitable for the military, aerospace, medical equipment, etc.; multiple reflow solder paste can solve the problem of inconsistency in the reliability of the two reflow joints; and water-soluble paste is a special type of solder paste used for soldering electronic components. Water-soluble solder paste is a special type of solder paste used for soldering electronic components. Fitech's solder adhesive products (also known as epoxy solder paste) are high-strength soldering products prepared by combining alloy solder powder with excellent sphericity, uniform particle size, low oxygen content and high strength with halogen-free epoxy flux. This kind of tin glue products in the welding and curing process only a very small amount of solvent volatilisation, after welding will not form a solder ball. After the solder powder melts and shrinks, the solder joints are connected by metallurgy. The flux residue becomes a thermosetting adhesive, which strengthens the solder joints and serves as corrosion protection and insulation. Fuyingda's solder adhesive products have the characteristics of no cleaning, anti-corrosion and high insulation, which is a new type of electronic packaging material. If you are interested, please feel free to come to communicate and negotiate!

 

 


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