Detailed explanation of the standard specifications and applications of tin powder particles

Tin powder has a wide range of uses and is commonly used as an additive and porous material in powder metallurgy. Tin powder is also used as a high purity reagent in the electronics industry. The particle standard of tin powder is generally reflected by the particle size distribution, particle size, sphericity, chemical purity, surface finish, oxygen content and other indicators.

Specific index embodiment:

1, particle size range:

According to the application requirements, the size range of tin powder particles can vary from submicron to several hundred microns. For example, tin powder for welding generally requires a finer particle size to ensure good welding performance and uniform melting effect.

2, morphology:

The morphology of tin powder can be spherical, irregular shape or other specific shapes. Standard specifications may require the morphology of tin powder to meet specific application requirements.

3.Particle size/particle size:

Standards often specify methods of measuring particle size distribution and data presentation (e.g., cumulative distribution curves, frequency distribution curves) to ensure consistent performance from batch to batch of powder.

Fine tin powder particles have a larger surface area, making them more likely to react with oxygen in the air, resulting in a significant increase in oxygen content. Assuming that the particles are spherical, the surface area A and volume V of a single particle are:

A=4πr2

V=34πr3

The total surface area per unit mass of powder is inversely proportional to the particle radius r, i.e., the total surface area increases as the particle radius decreases.

Tin powder is widely used in the electronics industry, and common tin powder models include No. 2 powder, No. 3 powder, No. 4 powder and No. 4 powder. Different models of tin powder play a vital role in the electronics industry by adjusting the particle diameter to suit different soldering needs. 2 and 3 powders are suitable for products with large solder joint spacing, while 4 and 5 powders are more suitable for high-density, miniaturized soldering scenarios.

When selecting tin powders, it is necessary to refer to the relevant standards and specifications according to the specific application needs and process requirements to ensure that the quality and performance of the powder meets the requirements. Fitech has global front-end technologies, such as liquid-phase moulding solder powder manufacturing technology, which can manufacture T2-T10 full-size ultra-fine alloy solder powder, and is currently the world's only manufacturer of electronic-grade encapsulation materials that can manufacture full-size T2-T10 ultra-fine alloy solder powder. With the advantages of narrow particle size distribution, low oxygen content and high chemical purity, FUJINDA has been universally recognised by the global manufacturers of SMT electronic chemicals, micro-optics and semiconductor packaging, and has become the leading unit in the formulation of electronic industry standard for solder powders by the Ministry of Industry and Information Technology (MIIT). Welcome to visit Fitech official website and communicate with us!