Detailed explanation of the production process of solder paste

The production process for solder paste is a complex process involving several steps designed to ensure the production of high-quality products for use in surface mount technology (SMT) in the electronics manufacturing industry. The following is a detailed production process:

1. Raw material preparation: Prepare the main raw materials required for solder paste production, including tin powder, resin and flux. Tin powder is the main component of solder paste, its quality and proportion will directly affect the performance of the paste. Resin acts as an adhesive, binding the tin powder and flux together to form a homogeneous mixture. Flux is used to promote the soldering process of wetting, anti-oxidation, de-oxidation and other processes.

2. Mixing: The prepared raw materials are put into the mixer according to a certain proportion for mixing. This process needs to ensure that all the raw materials are well mixed to ensure the performance and quality of the solder paste.

3. Filtering and screening: After mixing and stirring the solder paste needs to be filtered and screened to remove impurities and larger particles. This process can be carried out using a screen or sieve to ensure the purity and fineness of the paste.

4. Quality Inspection: Quality inspection of the produced solder paste, including appearance inspection, viscosity test, soldering performance test, and so on. This process can ensure that the quality of the solder paste meets the production requirements, to ensure the stability and reliability of the subsequent use of the process.

5. Packaging and storage: After the quality inspection, the solder paste can be packaged and stored. Packaging materials need to meet the relevant standards to ensure that the solder paste in the storage and transport process will not be contaminated or damaged. The storage environment also needs to be controlled

within the appropriate temperature and humidity range to maintain the performance and quality of the solder paste.

It is important to note that the production process of solder paste requires strict control of the parameters and conditions of each step to ensure that the solder paste produced has consistent performance and quality. Selection of appropriate alloys, such as Sn-Pb or lead-free alloys (e.g. Sn-Ag-Cu), determines the formulation based on application needs and soldering requirements. It also needs to be adjusted and optimised according to specific product requirements and customer needs. Here I briefly introduce the well-known solder paste brand Fuyinda solder paste production process its unique research and development of liquid-phase forming powder technology, the technology uses the principle of ultrasonic cavitation effect, can be used for T6 (5 ~ 15μm) above the ultra-micro solder powder preparation, and has achieved large-scale mass production. Liquid phase forming technology by placing liquid metal in another high temperature liquid medium, the use of high-speed shear or high-frequency ultrasonic energy to refine the liquid metal into tiny particles, suspended in the liquid medium, and then cooled and solidified into a spherical powder. This technology produces solder pastes with excellent process properties, including excellent printability, release and transfer, shape and stability retention, and sufficient and uniform print volume. In addition, Fuyingda's solder pastes have stable viscosity and thixotropy coefficients, can be printed continuously for 8 hours, and are available in both no-rinse and aqueous cleaning options.

It is because of this technology that Fithch is the only manufacturer of electronic grade encapsulation materials in the world that can manufacture T2-T10 full-size ultra-micro-alloy solder powders, and the liquid phase moulding technology has also obtained the national patent protection, and has demonstrated excellent performance in practical applications. Welcome to communicate and negotiate!