Industry Applications-Shenzhen Fitech Co., Ltd.

Home > Application>Industry Applications

Industry Applications

Fitech is a trusted partner for advanced microelectronics packaging. Our high-performance solder pastes enable innovative solutions across a wide range of industries, including 3C products, automotive electronics, IoT & wearables, medical devices, and 5G technology. With our advanced manufacturing facilities and a deep understanding of customer needs, we deliver tailored solutions featuring excellent thermal conductivity, low voiding, and exceptional print quality. Our commitment to innovation ensures that our products align with the latest industry trends and standards, such as high-density interconnect (HDI) and mini/micro LED packaging.

3C Products

3C products include computers, communication products such as mobile phones, and consumer products such as home appliances.

Learn More

Automotive Electronics

Fitech provides automotive-grade high-reliability packaging materials and solutions for customers.

Learn More

Iot & Wearables

The Internet of Things (IoT) has been widely regarded as the third wave of development in the information industry.

Learn More

Medical Equipment

Fitech offers safe and high-reliability materials and solutions for chip packaging of medical equipment.

Learn More

Military & Aerospace

Fitech provides customers in the military and aerospace fields with high-reliability packaging materials and solutions of RF chips

Learn More

Mini/Micro Led Packaging

The ultra-fine solder material produced by Fitech covers T6-T10 sizes, halogen-free, zero halogen-free, and halogen-free standards.

Learn More

Rail Transit

Fitech provides customers in the rail transit field with high-reliability packaging materials and solutions for power devices, IGBT chips, and modules.

Learn More

5G communication module provides high-speed, low-latency, and wide-coverage communication functions through 5G signals.

Learn More