Gold-Tin soldering powder, also known as AuSn solder, is renowned for its exceptional reliability in high-performance electronic packaging and semiconductor applications. Composed of a precise ratio of gold (Au) and tin (Sn), typically 80% gold and 20% tin, it offers superb thermal conductivity and electrical conductivity, making itself ideal for applications requiring robust solder joints that can withstand harsh environmental conditions. AuSn soldering powder exhibits excellent resistance to oxidation and corrosion, ensuring long-term stability and minimal degradation of solder joints over time. Its compatibility with various substrate materials and its ability to form strong metallurgical bonds contribute to its widespread use in advanced microelectronics, optoelectronics, and aerospace industries where reliability and performance are critical.