The Epoxy Flux

Fine-pitch flux assists in the manufacturing, assembly, and packaging of microelectronics and semiconductors. It is suitable for high precision and reliability packaging of wafer bumping soldering, chip evaporation soldering, BGA, SiP, CSP, Micro LED packaging, module integrated circuits, etc. Fitech's zero-halogen epoxy flux has self-assembly and self-correction functions. Epoxy curing after soldering provides excellent insulation, corrosion resistance, and reliability performance, and it is compatible with underfill and bonding. It can be used in the printing or dispensing process.

The epoxy flux (zero halogens) has the function of self-assembly and self-correction. The epoxy resin cured after soldering can improve the insulation and corrosion resistance of the solder joints. Besides, the epoxy flux is compatible with the underfill and bonding adhesive. The epoxy flux can be released to substrates through printing or dispensing.