10 +
T2-T10 All-Size Cases
20 + years
Industry Experience
20 +
Research Staff
40 +
Patents
Fitech’s ultra-fine solder pastes, fluxes, and full size and variety of alloy solder powders are widely applied across various sectors of microelectronics and semiconductor packaging. These products have gained widespread recognition from global SMT electronic chemical manufacturers, micro-optoelectronic manufacturers, and semiconductor packaging and testing companies. The company has established stable and long-term business partnerships with clients in over 20 countries.
With world-class research and development capabilities in microelectronics and semiconductor packaging solder materials, Fitech is committed to creating value for its customers through exceptional products and services, striving to become the best partner in the global microelectronics and semiconductor packaging industry.
Our History
1997
The establishment of Fitech in Shekou.
2006
A production rate of 220t/year for ultrasonic atomization solder powder.
2010
A production rate of 1500t/year for centrifugal atomization solder power.
2014
Scale production of ultra-fine solder powder and die attach solder paste and is the only company that can produce T2-T10 solder materials.
2015
The company was relocated to the Bao’an Industrial district, improving its research and development abilities.
2016
Low-temperature high-strength solder FL170/180/FL200 were developed.
2017
Certificates of the National High-Tech Enterprise and Shenzhen High-Tech Enterprise.
2019
Introduced solder paste products for mini/micro LED.
2020
Launch of water-soluble solder paste and gold-tin solder powder/solder paste.
2021
Certificates of ISO14001-2015, ISO9001-2015 and QC080000-2017.
2022
Certificates of Shenzhen SRDI Enterprise.Low-temperature high-strength solder FL series was authorized by China, Japan and USA to obtain patents.
2023
Certificates of the National SRDI Little Giant Enterprise and completed IATF16949 certification.
Fitech Provides Services for Customers Globally
With Microelectronic and Semiconductor Packaging Alloy Solder Solutions
