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Gold tin solder paste, Ultra-fine solder past...
10 +
T2-T10 All-Size Cases
20 +years
Industry Experience
20 +
Research Staff
40 +
Patents
WHO WE ARE
Fitech's Ultra-Fine Solder for Customer Innovation
Shenzhen Fitech Co., Ltd. is a global leader in providing soldering solutions for microelectronics and semiconductor packaging, with over 20 years of dedicated experience in the industry.
The company offers a comprehensive product line, ranging fromsolder alloy powderto ultra-fine soldering application products. It is currently the only manufacturer in the world capable of producing microelectronics and semiconductor packaging materials in the full range ofultra-fine solder alloys, from T2 to T10.
Fitech’s ultra-fine solder pastes, fluxes, and full size and variety of solder alloy powder are widely applied across various sectors of microelectronics and semiconductor packaging. These products have gained widespread recognition from global SMT electronic chemical manufacturers, micro-optoelectronic manufacturers, and semiconductor packaging and testing companies. The company has established stable and long-term business partnerships with clients in over 20 countries........
Solder paste, as an important electronic soldering material, plays a vital role in the electronics manufacturing industry. Its main function is to provide high quality solder connections, reduce oxidation, provide wettability and conductive heat transfer. Fitech solder paste covers a wide range of models and specifications, including ultra-fine solder paste, Gold-tin solder paste, medium temperature solder paste SAC305, low temperature solder paste, high temperature solder paste, etc., which are suitable for different microelectronics and semiconductor packaging needs.
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Solder powder is a kind of connecting material used in electronic industry, which is mainly composed of Sn (tin) and other metals (such as Pb, Ag, Cu, etc.) as alloy powder. Fitech solder powder adopts Fitech's patented powder making technology - liquid phase molding spherical alloy powder technology, which applies the principle of ultrasonic cavitation effect, and can be used for the preparation of ultra-fine solder powder T6 (5~15μm)， T7(2~11μm)，T8 (2~8μm)，T9 (1~5μm)，T10 (1~3μm)，and has already been mass-produced on a large scale. This technology enables the solder powder to have excellent sphericity and low oxygen content, which ensur
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Flux is an important and indispensable material in the soldering process, with the main functions of removing oxides, preventing re-oxidation, reducing surface tension and increasing the soldering area.Fitech fine pitch flux is a flux material used in microelectronics and semiconductor production, assembly and packaging. It is suitable for high-precision and high-reliability packaging in the fields of wafer bump soldering, chip vaporization soldering, BGA, SiP, CSP, MicroLED packaging.
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Our Professional Team is Here to Help
Our team is filled with seasoned experts who can’t wait to help you find the right solution for your business.
Contact Us NowDue to its high-quality and high-tech production and development, Fitech's products are used in various applications, including microelectronic packages and power device packages, such as simple 3C products, electronic packages in automobiles, IoT and wearable devices, medical devices, military and aerospace, LED packages, rail transportation and 5G...
FITECH's partners are all over the world, involving microelectronics, semiconductors, automotive, medical, military and other industries; We have a mature product line and can also assist our customers to make specific welding solutions for their specific projects. We work with customers to make progress and develop together....
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Non-wetting and De-wetting during Soldering
Non-wetting and de-wetting phenomenon is a common defect in the welding process, they are respectively manifested as incomplete contact between solder and base metal and retreat after partial wetting.
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Nov, 2025
Gold Embrittlement in BGA Solder Joints
Gold embrittlement is a soldering defect that refers to solder joints that contain too much intermetallic compound (IMC), resulting in increased brittleness and reduced reliability.
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Nov, 2025
Pin Device Desoldering Causes and Countermeasures
Desoldering refers to the reflow soldering process, one or more pins of the component can not be normal contact with the pad, resulting in incomplete or missing solder joints. Desoldering not only affects the performance and reliability of the circuit, but also increases the cost and difficulty of maintenance.
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Nov, 2025
Grape Ball Effect Causes the Effective Life of Solder Paste after Printing
Grape ball effect refers to the SMT reflow process, the paste can not be completely melted and wet pads, and the formation of a small ball similar to grapes, affecting the reliability and appearance of the solder joints.
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Nov, 2025
How to estimate the amount of solder paste to print?
Estimating solder paste printing volume is a critical step in surface mount technology (SMT), directly impacting soldering quality and costs.
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Nov, 2025
The Difference Between SPI and AOI in SMT
In surface mount technology (SMT) production processes, solder paste inspection (SPI) and automatic optical inspection (AOI) serve as two core quality control technologies. Through their distinct functions and collaborative efforts, they jointly establish an efficient quality assurance system.
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Nov, 2025
Alexander
I have been using this, the solder paste does not dry out in winter, the quality is particularly stable Recommended purchase.The seller's service is also very good, customs clearance is fast, and the speed of delivery is unbeatable. The price is also real, worthy of cooperation and trust!
David
Real manufacturers direct sales, product quality is no excuse, with SGS and other well-known institutions of the test report, the user can rest assured that the use of both environmental protection and safety.
Andrew
It is understood that Fitech solder paste in its domestic has a great influence, in 2014 on the independent research and development and production of T2-T10 particle size of the solder paste, only recently began to layout overseas, in fact, it is also more than 20 years of brand old shop.
Honey
With the use of Fuyinda's solder paste, fast tin down, strong oxidation resistance, good wettability, in particular, it can also be customised for the user's different scenarios of different alloys of solder powder, the configuration of different solder paste. This is for the modern electronics industry, the trend of ultra-micro is becoming more and more obvious, more and more popular with users.
