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Gold tin solder paste, Ultra-fine solder past...
10 +
T2-T10 All-Size Cases
20 +years
Industry Experience
20 +
Research Staff
40 +
Patents
WHO WE ARE
Fitech’s Ultra-Fine Solder Assists in Innovation
Shenzhen Fitech Co.,Ltd. is a global leader in providing soldering solutions for microelectronics and semiconductor packaging, with over 20 years of dedicated experience in the industry.
The company offers a comprehensive product line, ranging from alloy solder powders to ultra-fine soldering application products. It is currently the only manufacturer in the world capable of producing microelectronics and semiconductor packaging materials in the full range of ultra-fine alloy solders, from T2 to T10.
Fitech’s ultra-fine solder pastes, fluxes, and full size and variety of alloy solder powders are widely applied across various sectors of microelectronics and semiconductor packaging. These products have gained widespread recognition from global SMT electronic chemical manufacturers, micro-optoelectronic manufacturers, and semiconductor packaging and testing companies. The company has established stable and long-term business partnerships with clients in over 20 countries.
Solder paste, as an important electronic soldering material, plays a vital role in the electronics manufacturing industry. Its main function is to provide high quality solder connections, reduce oxidation, provide wettability and conductive heat transfer. Fitech solder paste covers a wide range of models and specifications, including ultra-fine solder paste, Gold-tin solder paste, medium temperature solder paste SAC305, low temperature solder paste, high temperature solder paste, etc., which are suitable for different microelectronics and semiconductor packaging needs.
View MoreSolder powder is a kind of connecting material used in electronic industry, which is mainly composed of Sn (tin) and other metals (such as Pb, Ag, Cu, etc.) as alloy powder. Fitech solder powder adopts Fitech's patented powder making technology - liquid phase molding spherical alloy powder technology, which applies the principle of ultrasonic cavitation effect, and can be used for the preparation of ultra-fine solder powder T6 (5~15μm), T7(2~11μm),T8 (2~8μm),T9 (1~5μm),T10 (1~3μm),and has already been mass-produced on a large scale. This technology enables the solder powder to have excellent sphericity and low oxygen content, which ensur
View MoreFlux is an important and indispensable material in the soldering process, with the main functions of removing oxides, preventing re-oxidation, reducing surface tension and increasing the soldering area.Fitech fine pitch flux is a flux material used in microelectronics and semiconductor production, assembly and packaging. It is suitable for high-precision and high-reliability packaging in the fields of wafer bump soldering, chip vaporization soldering, BGA, SiP, CSP, MicroLED packaging.
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Contact Us NowDue to its high-quality and high-tech production and development, Fitech's products are used in various applications, including microelectronic packages and power device packages, such as simple 3C products, electronic packages in automobiles, IoT and wearable devices, medical devices, military and aerospace, LED packages, rail transportation and 5G...
FITECH's partners are all over the world, involving microelectronics, semiconductors, automotive, medical, military and other industries; We have a mature product line and can also assist our customers to make specific welding solutions for their specific projects. We work with customers to make progress and develop together....
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